參數(shù)資料
型號: M36L0T7050
廠商: 意法半導體
英文描述: 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32 Mbit (2M x16) PSRAM, 1.8V Supply Multi-Chip Package
中文描述: 128兆位(多銀行,多層次,突發(fā))閃存32兆位(200萬× 16)移動存儲芯片,1.8V電源多芯片封裝
文件頁數(shù): 17/18頁
文件大小: 406K
代理商: M36L0T7050
17/18
M36L0R7050T0, M36L0R7050B0
REVISION HISTORY
Table 12. Document Revision History
Date
Version
Revision Details
29-Jul-2003
0.1
First Issue
03-Jun-2004
0.2
Package specifications updated. PSRAM component updated in accordance with
M69AR048B datasheet. Flash memory component updated in accordance with
M30L0R7000(T/B)0 datasheet.
Document status changed from Target Specification to Preliminary Data.
04-Dec-2004
1.0
TFBGA88 package fully compliant with the ST ECOPACK specification.
Document status promoted from Preliminary Data to full Datasheet.
Flash memory and PSRAM data updated to the version 1.0 of the M30L0R7000x0
datasheet and to the version 4.0 of the M69AR048B datasheet.
相關(guān)PDF資料
PDF描述
M36L0R7050B0ZAQF CAP 0.1UF 50V 10% X7R DIP-2 BULK P-MIL-C-39014
M36L0R7050B0ZAQT CAP 2.2PF 200V 0.5PF C0H DIP-2 BULK S-MIL-C-39014
M36L0R7050B0ZAQE ER 23C 16 12 8 4 SKT RECP WALL
M36L0R7050T0ZAQE AB 6C 2#0 4#4 SKT RECP
M36L0R7050T0ZAQT 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32 Mbit (2M x16) PSRAM, 1.8V Supply Multi-Chip Package
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M36L0T7050B0 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:128Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32Mbit (2M x16) PSRAM, Multi-Chip Package
M36L0T7050B0ZAQE 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays
M36L0T7050B0ZAQF 制造商:Micron Technology Inc 功能描述:WIRELESS - Tape and Reel
M36L0T7050B2 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package
M36L0T7050B2ZAQ 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package