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參數(shù)資料
| 型號： | M36P0R9070E0ZACE |
| 廠商： | 意法半導體 |
| 英文描述： | 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package |
| 中文描述： | 512兆位（x16插槽，多銀行，多層次，多突發(fā)）128兆位閃存（突發(fā)）移動存儲芯片，1.8V電源，多芯片封裝 |
| 文件頁數(shù)： | 23/26頁 |
| 文件大?。?/td> | 200K |
| 代理商： | M36P0R9070E0ZACE |
M36P0R9070E0
6 Package mechanical
23/26
Table 10.
Stacked TFBGA107 8x11mm - 9x12 active ball array, 0.8mm pitch, package data
Symbol
millimeters
inches
Typ
Min
Max
Typ
Min
Max
A
1.20
0.047
A1
0.20
0.008
A2
0.85
0.033
b
0.35
0.30
0.40
0.014
0.012
0.016
D
8.00
7.90
8.10
0.315
0.311
0.319
D1
6.40
0.252
ddd
0.10
0.004
E
11.00
10.90
11.10
0.433
0.429
0.437
E1
8.80
0.346
e
0.80
0.031
FD
0.80
0.031
FE
1.10
0.043
SE
0.40
0.016
相關PDF資料 |
PDF描述 |
|---|---|
| M36P0R9070E0ZACF | 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package |
| M36W0R6030B0 | 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package |
| M36W0R6030B0ZAQ | 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package |
| M36W0R6030B0ZAQE | 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package |
| M36W0R6030B0ZAQF | 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| M36P0R9070E0ZACF | 制造商:Micron Technology Inc 功能描述:WIRELESS - Tape and Reel |
| M36P0R9070E1ZACE | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays |
| M36P0R9070E1ZACF | 制造商:Micron Technology Inc 功能描述:WIRELESS - Tape and Reel |
| M36P0R9070N1ZSE | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays |
| M36P0R9070N1ZSF | 制造商:Micron Technology Inc 功能描述:WIRELESS - Tape and Reel |
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