MAX9257/MAX9258
2
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Fully Programmable Serializer/Deserializer
with UART/I2C Control Channel
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC_ to GND .........................................................-0.5V to +4.0V
Any Ground to Any Ground...................................-0.5V to +0.5V
SDI+, SDI-, SDO+, SDO- to GND..........................-0.5V to +4.0V
SDO+, SDO- Short Circuit to GND or VCCLVDS .........Continuous
DIN[0:15], GPIO[0:9], PCLK_IN, HSYNC_IN, VSYNC_IN,
SCL/TX, SDA/RX, REM to GND ............-0.5V to (VCCIO + 0.5V)
DOUT[0:15], PCLK_OUT, HSYNC_OUT, VSYNC_OUT, RX,
LOCK, TX,
PD, ERROR to GND ........-0.5V to (VCCOUT + 0.5V)
Continuous Power Dissipation (TA = +70°C)
40-Lead TQFN
Multilayer PCB (derate 35.7mW/°C above +70°C) .....2857mW
48-Lead LQFP
Multilayer PCB (derate 21.7mW/°C above +70°C) .....1739mW
Junction-to-Case Thermal Resistance (
θJC) (Note 1)
40-Lead TQFN .............................................................1.7°C/W
48-Lead LQFP ...............................................................10°C/W
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1)
40-Lead TQFN ..............................................................28°C/W
48-Lead LQFP ...............................................................46°C/W
ESD Protection
Human Body Model (RD = 1.5kΩ, CS = 100pF)
All Pins to GND ..............................................................±3kV
IEC 61000-4-2 (RD = 330Ω, CS = 150pF)
Contact Discharge
(SDI+, SDI-, SDO+, SDO-) to GND ................................±8kV
Air Discharge
(SDI+, SDI-, SDO+, SDO-) to GND ..............................±20kV
ISO 10605 (RD = 2kΩ, CS = 330pF)
Contact Discharge
(SDI+, SDI-, SDO+, SDO-) to GND ..............................±10kV
Air Discharge
(SDI+, SDI-, SDO+, SDO-) to GND ..............................±30kV
Machine Model (RD = 0Ω, CS = 200pF)
All Pins to GND ............................................................±200V
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
MAX9257 DC ELECTRICAL CHARACTERISTICS
(VCC_ = +3.0V to +3.6V, RL = 50Ω ±1%, TA = -40°C to +105°C, unless otherwise noted. Typical values are at VCC_ = +3.3V,
TA = +25°C.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SINGLE-ENDED INPUTS
VCCIO = +1.71V to +3V
0.65 x
VCCIO
VCCIO +
0.3
VCCIO = +3V to +3.6V
2
VCCIO +
0.3
High-Level Input Voltage
VIH
REM input
2
VCC +
0.3
V
VCCIO = +1.71V to +3V
0
0.3 x
VCCIO
VCCIO = +3V to +3.6V
0
0.8
Low-Level Input Voltage
VIL
REM input
0
0.8
V
VIN = 0 to VCCIO
VCCIO = +1.71V to +3.6V
-20
+20
Input Current
IIN
VIN = 0 to VCC, REM input
-20
+20
A
Input Clamp Voltage
VCL
ICL = -18mA
-1.5
V
SINGLE-ENDED OUTPUTS
IOH = -100A
VCCIO -
0.1
High-Level Output Voltage
VOH
IOH = -2mA
VCCIO -
0.35
V
Note 1: Package thermal resistances were obtained using the method described in JDEC specification JESD51-7, using a 4-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.