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參數(shù)資料
| 型號： | MC33298 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | Eight Output Switch with Serial Peripheral Interface I/O(帶SPI接口的八輸出開關(guān)) |
| 中文描述： | 8個串行外圍接口的I / O（帶的SPI接口的八輸出開關(guān)輸出開關(guān)） |
| 文件頁數(shù)： | 4/28頁 |
| 文件大小： | 642K |
| 代理商： | MC33298 |
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33298
4
Go to: www.freescale.com
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Power Supply Voltage
Normal Operation (Steady-State)
Transient Conditions (Note 1)
V
PWR(SS)
V
PWR(PK)
- 1.5 to 26.5
- 13 to 60
V
Logic Supply Voltage (Note 2)
V
DD
- 0.3 to 7.0
V
Input Pin Voltage (Note 3)
V
IN
- 0.3 to 7.0
V
Output Clamp Voltage (Note 4)
2.0 mA
≤
I
OUT
≤
0.5 A
V
OUT(OFF)
50 to 75
V
Output Self-Limit Current
I
OUT(LIM)
3.0 to 6.0
A
Continuous Per Output Current (Note 5)
I
OUT(CONT)
1.0
A
ESD Voltage (Note 6)
Human Body Model (Note 7)
Machine Model (Note 8)
V
ESD1
V
ESD2
2000
200
V
Output Clamp Energy (Note 9)
Repetitive:
T
J
= 25
°
C
T
J
= 124
°
C
Non-Repetitive:
T
J
= 25
°
C
T
J
= 124
°
C
E
CLAMP
100
30
2.0
0.5
mJ
mJ
J
J
Recommended Frequency of SPI Operation (Note 11)
f
SPI
2.0
MHz
Storage Temperature
T
STG
- 55 to 150
°
C
Operating Case Temperature
T
C
- 40 to 125
°
C
Operating Junction Temperature
T
J
- 40 to 150
°
C
Power Dissipation (
T
A
= 25
°
C) (Note 12)
P
D
3.0
W
Soldering Temperature (Note 13)
T
SOLDER
260
°
C
Notes:
1.
2.
3.
4.
5.
Transient capability with external 100
resistor in series with VP pin and supply.
Exceeding these limits may cause a malfunction or permanent damage to the device.
Exceeding the limits on SCLK, SI, CS, SFPD, or RST pins may cause permanent damage to the device.
With output OFF.
Continuous output current rating so long as maximum junction temperature is not exceeded. Operation at 125
°
C ambient temperature will
require maximum output current computation using package R
θ
JA
.
ESD data available upon request.
ESD1 testing is performed in accordance with the Human Body Model (C
Zap
= 200 pF, R
Zap
= 1500
).
ESD2 testing is performed in accordance with the Machine Model (C
Zap
= 200pF, R
Zap
= 0
).
Maximum output clamp energy capability at 150
°
C
junction temperature using a single non-repetitive pulse method.
Guaranteed and production tested for 2.0 MHz SPI operation, but demonstrated to operate to 8.5 MHz at 25
°
C.
See Figure 20 for Thermal model.
Soldering temperature limit is for 10 seconds maximum duration; not designed for immersion soldering; exceeding these limits may cause
malfunction or permanent damage to the device.Contact Motorola Sales Office for device immersion soldering time/temperature limits.
6.
7.
8.
9.
10.
11.
12.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
n
.
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