參數(shù)資料
型號： MC33394
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
元件分類： CAN
英文描述： Switch Mode Power Supply with Multiple Linear Regulators and High Speed CAN Transceiver(帶有多個線性穩(wěn)壓器和高速CAN收發(fā)器的開關(guān)方式電源)
中文描述： 開關(guān)電源的多線性穩(wěn)壓器和高速CAN收發(fā)器（帶有多個線性穩(wěn)壓器和高速的CAN收發(fā)器的開關(guān)方式電源）
文件頁數(shù)： 6/44頁
文件大?。?/td> 641K
代理商： MC33394
6
Go to: www.freescale.com
1. MAXIMUM RATINGS
(Maximum Ratings indicate sustained limits beyond which damage to the device may occur.
Voltage parameters are absolute voltages referenced to ground.)
Parameter
Min.
–0.3
–18
–0.3
–2.0
–18
Max.
+45
+45
+5.8
+18
+26.5
Unit
V
V
V
V
V
Supply Voltage (VBAT), Load Dump
Supply Voltage (KA_VBAT, VIGN), Load Dump
Supply Voltages (VDDH, VPP, VDD3_3, VDDL, VKAM)
Supply Voltages (VREF1, VREF2, VREF3, VSEN)
CANL, CANH (0<VBAT<18 VDC no time limit)
ESD Voltage
Human Body Model all pins
Machine Model all pins
CANLesd, CANHesd
CANLesd, CANHesd
CANLtransient, CANHtransient
/SLEEP
REGON, VPP_EN, /HRESET, /PORESET, /PRERESET, HRT, DO, DI, CS, SCLK
CANTXD, CANRXD
Operational Package Temperature [Ambient Temperature]
Storage Temperature
Power Dissipation (TA = 125 C)
44 HSOP
44 QFN
54 SOICW–EP
Lead Soldering Temperature
Maximum Junction Temperature
R
θ
JA, Thermal Resistance, Junction to Ambient (44 HSOP)
R
θ
JC, Thermal Resistance, Junction to Case (44 HSOP)
R
θ
JB, Thermal Resistance, Junction to Base (44 HSOP)
R
θ
JA, Thermal Resistance, Junction to Ambient (44 QFN)
R
θ
JC, Thermal Resistance, Junction to Case (44 QFN)
R
θ
JB, Thermal Resistance, Junction to Base (44 QFN)
R
θ
JA, Thermal Resistance, Junction to Ambient (54 SOICW–EP)
R
θ
JC, Thermal Resistance, Junction to Case (54 SOICW–EP)
R
θ
JB, Thermal Resistance, Junction to Base (54 SOICW–EP)
1. Human body model: C = 100 pF, R = 1.5 k
.
2. Machine model: C = 200 pF, R = 10
and L = 0.75
μ
H. In case of a discharge from pin CANL to pin GND: – 100 V < CANL transient < +100
V; in case of a discharge from pin CANH to Vcc: –150 V < CANH transient < +150 V.
3. The waveforms of the applied transients is in accordance with ”ISO 7637 part 1” test pulses 1, 2, 3a and 3b.
4. Maximum power dissipation at indicated junction temperature.
5. Lead soldering temperature limit is for 10 seconds maximum duration; contact Motorola Sales Office for device immersion soldering
time/temperature limits.
6. Thermal resistance measured in accordance with EIA/JESD51–2.
7. Theoretical thermal resistance from the die junction to the exposed pad.
8. Thermal resistance measured in accordance with JESD51–8.
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 3)
–2.0
–200
–4.0
–200
–200
–18
–0.3
–0.3
–40
–65
+2.0
+200
+4.0
+200
+200
+45
+7.0
+7.0
+125
+150
kV
V
kV
V
V
V
V
V
°
C
°
C
(Note 4)
(Note 4)
(Note 4)
(Note 5)
8.3
5.0
5.0
260
+150
41
0.2
3
77
1.7
5.0
52
1.2
8.1
W
W
W
C
°
C
(Note 6)
(Note 7)
(Note 8)
(Note 6)
(Note 7)
(Note 8)
(Note 6)
(Note 7)
(Note 8)
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
2. RECOMMENDED OPERATING CONDITIONS
(
All voltages are with respect to ground unless otherwise noted)
Parameter
Value
Unit
Supply Voltages (VBAT, KA_VBAT)
Switching Regulator Output Current (IVPRE)
VDDH Output Current
VDD3_3 Output Current
VDDL_B Pass Transistor Base Drive Current
VPP Output Current
VREF Output Current
VSEN Output Current
VKAM Standby Output Current (normal mode of operation)
VKAM Standby Output Current (standby mode of operation)
1. See Typical Application Diagram in Figure 1.
4.0 to 26.5
0 to 1.2
0 to 400
0 to 120
0 to 40
0 to 150
0 to 100
0 to 125
0 to 60
0 to 12
V
A
(Note 1)
mA
mA
mA
mA
mA
mA
mA
mA
F
Freescale Semiconductor, Inc.
For More Information On This Product,
n
.
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