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參數(shù)資料
| 型號(hào)： | MC33888FB |
| 廠商： | 飛思卡爾半導(dǎo)體(中國(guó))有限公司 |
| 英文描述： | Quad High Side and Octal Low Side Switch for Automotive Applications(4高端開(kāi)關(guān)及8低端開(kāi)關(guān)，用于自動(dòng)應(yīng)用) |
| 中文描述： | 四高側(cè)和汽車應(yīng)用八路低邊開(kāi)關(guān)（4高端開(kāi)關(guān)及8低端開(kāi)關(guān)，用于自動(dòng)應(yīng)用） |
| 文件頁(yè)數(shù)： | 5/18頁(yè) |
| 文件大小： | 711K |
| 代理商： | MC33888FB |
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MC33888FB
Quad High Side and Octal Low Side Switch for Automotive
5
MAXIMUM RATINGS
NOTES:
1 Exceeding voltage limits on SCLK, SI, CSB, WDin, RSTB, IHS, FSI or ILS pins may cause permanent damage to the device.
2 Low-side output continuous output rating so long as maximum junction temperature is not exceeded. Operation at 125 Deg C ambient temperature will require
maximum output current computation using package thermal resistances
3 High-side output continuous output rating so long as maximum junction temperature is not exceeded. Operation at 125 Deg C ambient temperature will require
maximum output current computation using package thermal resistances
4 Active HS0,1 clamp energy using the following conditions: single pulse data pending
5 Active HS2,3 clamp energy using the following conditions: single pulse data pending
6 Active LS clamp energy using the following conditions: single non-repetitive pulse, 450mA, Tj=150C
7 ESD1 testing is performed in accordance with the Human Body Model (Czap = 100pF, Rzap = 1500Ohms )
8 ESD2 testing is performed in accordance with the Machine Model (Czap = 100pF, Rzap = 0Ohm)
9 ESD3 testing is performed in accordance with the system module specification and will include at least 0.01uF of capacitance external to the device on each
tested output (HS0-3, LS4-11, VPWR)
Parameter
Symbol
Value
Unit
Power Supply Voltage
Steady State
VPWR(sus)
-16 to 41
V
Input Pin Voltage (Note 1)
VIN
-0.3 to 7.0
V
WAKE Input Pin Clamp Current
WICI
2.5
mA
LS 4,6,8,10 Continuous Per Output Current
(Note 2)
IOUTLS4,6,8,10
500
mA
LS 5,7,9,11 Continuous Per Output Current
(Note 2)
IOUTLS5,7,9,11
800
mA
HS0,1 Continuous Per Output Current (Note 3)
IOUTHS0,1
10
A
HS2,3 Continuous Per Output Current
(Note 3)
IOUTHS2,3
5
A
HS0,1 Output Clamp Energy (Note 4)
EHS0,1
1.5
J
HS2,3 Output Clamp Energy (Note 5)
EHS2,3
1.2
J
LS Output Clamp Energy (Note 6)
ELS
50
mJ
Storage Temperature
Tstg
-55 to 150
Deg C
Operating Junction Temperature
Tjunc
-40 to 150
Deg C
Control Die Thermal Resistance (C/W)
One LS on
All LS on
theta Cjc
12
5
C/W
Power Die Thermal Resistance (C/W)
One HS2,3 on
All HSx on
theta Pjc
4
2
C/W
C/W
Ambient Thermal Resistance
theta ja
C/W
ESD Voltage
Human Body Model (Note 7)
Machine Model (Note 8)
Module (Note 9)
VESD1
VESD2
VESD3
2000
200
10000
V
V
V
F
Freescale Semiconductor, Inc.
For More Information On This Product,
n
.
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