參數(shù)資料
型號： MC56F8345VFGE
廠商： Freescale Semiconductor
文件頁數(shù)： 77/172頁
文件大?。?/td> 0K
描述： IC DSP 16BIT 60MHZ 128-LQFP
標準包裝： 72
系列： 56F8xxx
核心處理器： 56800E
芯體尺寸： 16-位
速度： 60MHz
連通性： CAN，EBI/EMI，SCI，SPI
外圍設備： POR，PWM，溫度傳感器，WDT
輸入/輸出數(shù)： 49
程序存儲器容量： 136KB（68K x 16）
程序存儲器類型： 閃存
RAM 容量： 6K x 16
電壓 - 電源 (Vcc/Vdd)： 2.25 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 16x12b
振蕩器型： 外部
工作溫度： -40°C ~ 105°C
封裝/外殼： 128-LQFP
包裝： 托盤
配用： MC56F8367EVME-ND - EVAL BOARD FOR MC56F83X
56F8345 Technical Data, Rev. 17
168
Freescale Semiconductor
Preliminary
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back-calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction-to-case
thermal resistance.
12.2 Electrical Design Considerations
Use the following list of considerations to assure correct operation of the 56F8345/56F8145:
Provide a low-impedance path from the board power supply to each VDD pin on the device, and from the
board ground to each VSS (GND) pin
The minimum bypass requirement is to place six 0.01–0.1
μF capacitors positioned as close as possible to
the package supply pins. The recommended bypass configuration is to place one bypass capacitor on each
of the VDD/VSS pairs, including VDDA/VSSA. Ceramic and tantalum capacitors tend to provide better
performance tolerances.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip VDD and VSS (GND)
pins are less than 0.5 inch per capacitor lead
Use at least a four-layer Printed Circuit Board (PCB) with two inner layers for VDD and VSS
Bypass the VDD and VSS layers of the PCB with approximately 100μF, preferably with a high-grade
capacitor such as a tantalum capacitor
CAUTION
This device contains protective circuitry to guard
against damage due to high static voltage or electrical
fields. However, normal precautions are advised to
avoid
application
of
any
voltages
higher
than
maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are
tied to an appropriate voltage level.
相關(guān)PDF資料
PDF描述
73S1215F-68IM/F/P IC SMART CARD READER PROG 68-QFN
73S1215F-44IMR/F/P IC SMART CARD READER PROG 44-QFN
73S1215F-44IM/F/P IC SMART CARD READER PROG 44-QFN
73S1210F-68IM/F/P IC SMART CARD READER PROG 68-QFN
73S1210F-44IMR/F/P IC SMART CARD READER PROG 44-QFN
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC56F8346 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers
MC56F8346EVM 制造商:Freescale Semiconductor 功能描述:Tools Development kit Kit Contents:Inst
MC56F8346MFV60 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 60MHz 60MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
MC56F8346MFVE 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 16 BIT HYBRID CONTROLLER RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
MC56F8346VFV60 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 60MHz 60MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*