參數(shù)資料
型號(hào): MC68HC05E6CFB
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 8-BIT, MROM, 2.1 MHz, MICROCONTROLLER, PQFP44
封裝: PLASTIC, QFP-44
文件頁數(shù): 10/140頁
文件大小: 1584K
代理商: MC68HC05E6CFB
Electrical Specifications
Thermal characteristics and power considerations
MC68HC05E6 — Rev. 1.0
Electrical Specifications
Thermal characteristics and power considerations
The average chip junction temperature, TJ, in degrees Celcius can be
obtained from the following equation:
[1]
where:
TA = Ambient temperature (°C)
θ
JA = Package thermal resistance, junction-to-ambient (°C/W)
PD = PINT + PI/O (W)
PINT = Internal chip power = IDD VDD (W)
PI/O = Power dissipation on input and output pins (user determined)
An approximate relationship between PD and TJ (if PI/O is neglected) is:
[2]
Solving equations [1] and [2] for K gives:
[3]
where K is a constant for a particular part. K can be determined by
measuring PD (at equilibrium) for a known TA. Using this value of K, the
values of PD and TJ can be obtained for any value of TA by solving the
above equations. The package thermal characteristics are shown in
Table 20 Package thermal characteristics
Characteristics
Symbol
Value
Unit
Thermal resistance
– Plastic 44 pin QFP package
– Plastic 28 pin SOIC package
θ
JA
θ
JA
60
°C/W
T
J
T
A
P
D
θ
JA
()
+
=
P
D
K
T
J
273
+
---------------------
=
KP
D
T
A
273
+
()
θ
JA
P
D
2
+
=
Figure 29 Equivalent test load
VDD = 4.5 V
R2
R1
C
Test
point
Pins
R1
R2
C
PA0–7, PB0–7, PC0–7, PD0–7, PG0–3
3.26k
2.38k 50pF
3-elec
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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