參數(shù)資料
型號: MC68HC05RC17DW
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 8-BIT, MROM, 2.097 MHz, MICROCONTROLLER, PDSO28
封裝: SOIC-28
文件頁數(shù): 26/128頁
文件大小: 561K
代理商: MC68HC05RC17DW
MC68HC05RC17 Rev. 2.0
General Release Specification
MOTOROLA
Mechanical Specifications
121
NON-DISCLOSURE
AGREEMENT
REQUIRED
General Release Specification — MC68HC05RC17
Section 13. Mechanical Specifications
13.1 Contents
13.2 Introduction
This section describes the dimensions of the dual in-line package (DIP)
and small outline integrated circuit (SOIC) MCU packages.
13.3 28-Pin Plastic Dual In-Line Package (Case 710-02)
0.100 BSC
0.600 BSC
2.54 BSC
15.24 BSC
MIN
MAX
MILLIMETERS
INCHES
DIM
36.45
13.72
3.94
0.36
1.02
1.65
0.20
2.92
0.51
37.21
14.22
5.08
0.56
1.52
2.16
0.38
3.43
15°
1.02
1.435
0.540
0.155
0.014
0.040
0.065
0.008
0.115
0.020
1.465
0.560
0.200
0.022
0.060
0.085
0.015
0.135
15°
0.040
A
B
C
D
F
G
H
J
K
L
M
N
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
114
15
28
B
A
C
N
K
M
J
D
SEATING
PLANE
F
HG
L
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