參數(shù)資料
型號: MC68HC681P
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 2 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PDIP40
封裝: PLASTIC, DIP-40
文件頁數(shù): 52/88頁
文件大小: 461K
代理商: MC68HC681P
Electrical Specifications
5-2
MC68HC681 USER’S MANUAL
MOTOROLA
5
Where K is a constant pertaining to the particular part. K can be determined from equation
(3) by measuring PD (at equilibrium) for a known TA. Using this value of K the values of PD
and TJ can be obtained by solving equations (1) and (2) iteratively for any value of TA.
The total thermal resistance of a package (
θ
JA) can be separated into two components, θJC
and
θ
CA, representing the barrier to heat flow from the semiconductor junction to the
package (case) surface (
θ
JC) and from the case to the outside ambient (θCA). These terms
are related by the equation:
θ
JA = θJC + θCA
(4)
θ
JC is device-related and cannot be influenced by customers. However, θCA is customer-
dependent and can be minimized by such thermal management techniques as heat sinks,
ambient air cooling, and thermal convention. Thus, good thermal management on the part
of the customer can significantly reduce
θ
CA so that θJA approximately equals θJC.
Substitution of
θ
JC for θJA in equation (1) will result in a lower semiconductor junction
temperature.
Values for thermal resistance presented in this data sheet, unless estimated, were derived
using the procedure described in Motorola Reliability Report 7843, "Thermal Resistance
Measurement Method for MC68XX Microcomponent Devices", and are provided for design
purposes only. Thermal measurements are complex and dependent on procedure and
setup. Customer-derived values for thermal resistance may differ.
5.4 DC ELECTRICAL CHARACTERISTICS
TA = 0°C to 70°C, VCC = 5.0 V ± 5%
All voltage measurements are referenced to ground (GND).
CHARACTERISTIC
SYMBOL
MIN
MAX
UNIT
Input High Voltage, Except X1
VIH
2.0
V
Input High Voltage, X1
VIH
4.0
V
Input Low Voltage
VIL
0.8
V
Output High Voltage, Except Open-Collector Outputs (IOH = -)
VOH
2.4
V
Output Low Voltage (IOL = )
VOL
0.6
V
Input Leakage Current (Vin = 0 to VCC)IIL
-5
5
A
Data Bus Hi-Z Leakage Current (Vout = 0 to VCC)ILL
-5
5
A
Open-Collector Output Leakage Current (Vout = 0 to VCC)IOC
-5
5
A
Power Supply Current
ICC
25
mA
Capacitance (Vin = 5 V, TA = 25°C, f = 1 MHz)
Cin
—15
pF
X1 Low Input Current
Vin = 0, X2 Floated
IX1L
-10
mA
X1 High lnput Current
Vin = VCC, X2 Floated
IX1H
—10
mA
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