參數(shù)資料
型號(hào)： MC7448VU667NC
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 4/60頁(yè)
文件大?。?/td> 0K
描述： IC MPU RISC 32BIT 360-FCCBGA
標(biāo)準(zhǔn)包裝： 44
系列： MPC74xx
處理器類型： 32-位 MPC74xx PowerPC
速度： 667MHz
電壓： 1V
安裝類型： 表面貼裝
封裝/外殼： 360-CBGA，F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝： 360-FCCBGA（25x25）
包裝： 托盤
MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
12
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 5 provides the package thermal characteristics for the MPC7448. For more information regarding
Table 6 provides the DC electrical characteristics for the MPC7448.
Table 5. Package Thermal Characteristics1
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board
RθJA
26
C/W
2, 3
Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board
RθJMA
19
C/W
2, 4
Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board
RθJMA
22
C/W
2, 4
Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board
RθJMA
16
C/W
2, 4
Junction-to-board thermal resistance
RθJB
11
C/W
5
Junction-to-case thermal resistance
RθJC
< 0.1
C/W
6
Notes:
1. Refer to Section 9.7, “Power and Thermal Management Information,” for details about thermal management.
2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
3. Per JEDEC JESD51-2 with the single-layer board horizontal
4. Per JEDEC JESD51-6 with the board horizontal
5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
6. This is the thermal resistance between die and case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.
Table 6. DC Electrical Specifications
At recommended operating conditions. See Table 4.
Characteristic
Nominal Bus
Voltage 1
Symbol
Min
Max
Unit
Notes
Input high voltage
(all inputs)
1.5
VIH
OVDD × 0.65
OVDD + 0.3
V
2
1.8
OVDD × 0.65
OVDD + 0.3
2.5
1.7
OVDD + 0.3
Input low voltage
(all inputs)
1.5
VIL
–0.3
OVDD × 0.35
V
2
1.8
–0.3
OVDD × 0.35
2.5
–0.3
0.7
Input leakage current, all signals except
BVSEL0, LSSD_MODE, TCK, TDI, TMS,
TRST:
Vin = OVDD
Vin = GND
—Iin
—
50
– 50
A
2, 3
Input leakage current, BVSEL0,
LSSD_MODE, TCK, TDI, TMS, TRST:
Vin = OVDD
Vin = GND
—Iin
—
50
– 2000
A
2, 6
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