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| 型號： | MC7448VU867NC |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 3/60頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU RISC 32BIT 360-FCCBGA |
| 標(biāo)準(zhǔn)包裝： | 44 |
| 系列： | MPC74xx |
| 處理器類型： | 32-位 MPC74xx PowerPC |
| 速度： | 867MHz |
| 電壓： | 1V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 360-CBGA，F(xiàn)CCBGA |
| 供應(yīng)商設(shè)備封裝： | 360-FCCBGA（25x25） |
| 包裝： | 托盤 |
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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
Freescale Semiconductor
11
Electrical and Thermal Characteristics
Table 4 provides the recommended operating conditions for the MPC7448 part numbers described by this
document; see Section 11.1, “Part Numbers Fully Addressed by This Document,” for more information.
See Section 9.2, “Power Supply Design and Sequencing” for power sequencing requirements.
Table 4. Recommended Operating Conditions1
Characteristic
Symbol
Recommended Value
Unit Notes
1000 MHz
1420 MHz
1600 MHz
1700 MHz
Min
Max
Min
Max
Min
Max
Min
Max
Core supply voltage
VDD
1.15 V ± 50 mV 1.2 V ± 50 mV 1.25 V ± 50 mV
1.3 V +20/
–50 mV
V
3, 4, 5
PLL supply voltage
AVDD
1.15 V ± 50 mV 1.2 V ± 50 mV 1.25 V ± 50 mV
1.3 V +20/
–50 mV
V
2, 3, 4
Processor
bus
supply
voltage
I/O Voltage Mode = 1.5 V
OVDD
1.5 V ± 5%
V
4
I/O Voltage Mode = 1.8 V
1.8 V ± 5%
4
I/O Voltage Mode = 2.5 V
2.5 V ± 5%
4
Input
voltage
Processor bus
Vin
GND
OVDD
GND
OVDD
GND
OVDD GND OVDD
V
JTAG signals
Vin
GND
OVDD
GND
OVDD
GND
OVDD GND OVDD
Die-junction temperature
Tj
0
105
0
105
0
105
0
105
C
C6
Notes:
1. These are the recommended and tested operating conditions.
2. This voltage is the input to the filter discussed in Section 9.2.2, “PLL Power Supply Filtering,” and not necessarily the voltage
at the AVDD pin, which may be reduced from VDD by the filter.
3. Some early devices supported voltage and frequency derating whereby VDD (and AVDD) could be reduced to reduce power
consumption. This feature has been superseded and is no longer supported. See Section 5.3, “Voltage and Frequency
Derating,” for more information.
4. Caution: Power sequencing requirements must be met; see Section 9.2, “Power Supply Design and Sequencing”.
5. Caution: See Section 9.2.3, “Transient Specifications” for information regarding transients on this power supply.
6. For information on extended temperature devices, see Section 11.2, “Part Numbers Not Fully Addressed by This Document.”
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