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參數(shù)資料
| 型號： | MC8641DHX1250HE |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 120/130頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DUAL CORE PROCESSOR 1023-CBGA |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | MPC86xx |
| 處理器類型： | 32-位 MPC86xx PowerPC |
| 速度： | 1.25GHz |
| 電壓： | 1.05V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 1023-BCBGA，F(xiàn)CCBGA |
| 供應(yīng)商設(shè)備封裝： | 1023-FCCBGA（33x33） |
| 包裝： | 托盤 |
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MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
9
Electrical Characteristics
Junction temperature range
TJ
0 to 105
C
C—
Notes:
1. Core 1 characteristics apply only to MPC8641D
2. If two separate power supplies are used for VDD_Core0 and VDD_Core1, they must be at the same nominal voltage and the
individual power supplies must be tracked and kept within 100 mV of each other during normal run time.
3. Caution: D
n
_MV
4. Caution: L/TVIN must meet the overshoot/undershoot requirements for L/TVDD as shown in Figure 2 during regular run time.
5. Caution: OVIN must meet the overshoot/undershoot requirements for OVDD as shown in Figure 2 during regular run time.
7. Applies to devices marked with a core frequency of 1333 MHz and below. Refer to Table 74 Part Numbering Nomenclature
to determine if the device has been marked for a core frequency of 1333 MHz and below.
8. Applies to devices marked with a core frequency above 1333 MHz. Refer to Table 74 Part Numbering Nomenclature to
determine if the device has been marked for a core frequency above 1333 MHz.
9. The 2.5 V ± 125 mV range is for DDR and 1.8 V ± 90 mV range is for DDR2.
10. See Section 8.2, “FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI AC Timing Specifications,” for details on the recommended
operating conditions per protocol.
11. The PCI Express interface of the device is expected to receive signals from 0.175 to 1.2 V. For more information refer to
12. Applies to Part Number MC8641xxx1000NX only. VDD_Coren = 0.95 V and VDD_PLAT = 1.05 V devices. Refer to Table 74
Part Numbering Nomenclature to determine if the device has been marked for VDD_Coren = 0.95 V.
13. This voltage is the input to the filter discussed in Section 20.2, “Power Supply Design and Sequencing,” and not necessarily
the voltage at the AVDD_Coren pin, which may be reduced from VDD_Coren by the filter.
Table 2. Recommended Operating Conditions (continued)
Characteristic
Symbol
Recommended
Value
Unit
Notes
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MC8641DHX1000GE | IC DUAL CORE PROCESSOR 1023-CBGA |
| MPC8572VTAVND | MPU POWERQUICC III 1023-PBGA |
| MPC8572VTAVNB | MPU POWERQUICC III 1023-PBGA |
| MPC8572VTAULB | MPU POWERQUICC III 1023-PBGA |
| MPC8572VTATLB | MPU POWERQUICC III 1023-PBGA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC8641DHX1250J | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641DHX1250K | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641DHX1250N | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641DHX1333G | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641DHX1333H | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
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