
MOTOROLA
Chapter 8. Package Description
8-1
Chapter 8
Package Description
This chapter provides the package parameters and mechanical dimensions for the
MC92602 device. This chapter consists of the following sections:
The MC92602 is offered in a 196 MAPBGA package. The 196 MAPBGA utilizes an
aggressive 1-mm ball pitch and 15-mm body size for application where board space is
limited.
8.1
196 MAPBGA Package Parameter Summary
Package type—fine pitch ball grid array
Package outline—15 mm
× 15 mm
Package height—1.60 mm max
Number of balls—196
Ball pitch—1 mm
Ball diameter—0.45–0.55 mm
8.2
Nomenclature and Dimensions of the
196 MAPBGA Package
Figure 8-1 provides the bottom surface nomenclature and package outline drawing of the
a graphic of the package pin signal mappings.
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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