參數(shù)資料
型號(hào)： MCF5480
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： MCF548x ColdFire㈢ Microprocessor
中文描述： MCF548x微處理器的ColdFire㈢
文件頁(yè)數(shù)： 5/34頁(yè)
文件大小： 403K
代理商： MCF5480
DC Electrical Specifications
MCF548x ColdFire
Microprocessor, Rev. 4
Freescale Semiconductor
5
2.2
Thermal Resistance
Table 3
lists thermal resistance values.
3
DC Electrical Specifications
Table 4
lists DC electrical operating temperatures. This table is based on an operating voltage of EV
DD
= 3.3 V
DC
± 0.3 V
DC
and IV
DD
of 1.5 ± 0.07 V
DC
.
Table 3. Thermal Resistance
Characteristic
Symbol
Value
Unit
324 pin TEPBGA — Junction to ambient, natural
convection
Four layer board (2s2p)
θ
JMA
20–22
1,2
1
θ
JA
and
Ψ
jt
parameters are simulated in accordance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
θ
JA
and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction
temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device
junction temperature specification can be verified by physical measurement in the customer’s system using the
Ψ
jt
parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.
2
Per JEDEC JESD51-6 with the board horizontal.
3
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
4
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
5
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
°
C/W
388 pin TEPBGA — Junction to ambient, natural
convection
Four layer board (2s2p)
θ
JMA
19
1
,
2
°
C/W
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
θ
JMA
θ
JB
θ
JC
Ψ
jt
16
1
,
2
°
C/W
Junction to board
—
11
3
°
C/W
Junction to case
—
7
4
°
C/W
Junction to top of package
Natural convection
2
1
,5
°
C/W
Table 4. DC Electrical Specifications
Characteristic
Symbol
Min
Max
Units
External (I/O pads) operation voltage range
EV
DD
3.0
3.6
V
Memory (I/O pads) operation voltage range (DDR Memory)
SD V
DD
2.30
2.70
V
Internal logic operation voltage range
1
IV
DD
1.43
1.58
V
PLL Analog operation voltage range
1
PLL V
DD
1.43
1.58
V
USB oscillator operation voltage range
USB_OSV
DD
3.0
3.6
V
USB digital logic operation voltage range
USBV
DD
3.0
3.6
V
USB PHY operation voltage range
USB_PHYV
DD
3.0
3.6
V
USB oscillator analog operation voltage range
USB_OSCAV
DD
1.43
1.58
V
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