參數(shù)資料
型號： MCIMX31_07
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述： Multimedia Applications Processors
中文描述： 多媒體應(yīng)用處理器
文件頁數(shù)： 1/108頁
文件大?。?/td> 1235K
代理商： MCIMX31_07
Freescale Semiconductor, Inc., 2005, 2006, 2007. All rights reserved.
Freescale Semiconductor
Data Sheet: Advance Information
This document contains information on a new product. Specifications and information herein are subject to change without notice.
Document Number: MCIMX31
Rev. 2.3, 03/2007
MCIMX31 and
MCIMX31L
Package Information
Plastic Package
Case 1581 14 x 14 mm, 0.5 mm Pitch
Ordering Information
See
Table 1
on page 3
for ordering information.
1
Introduction
The i.MX31 (MCIMX31) and i.MX31L (MCIMX31L)
are multimedia applications processors that represent the
next step in low-power, high-performance application
processors. Unless otherwise specified, the material in
this data sheet is applicable to both the i.MX31 and
i.MX31L processors. The i.MX31L does not include a
graphics processing unit (GPU).
Based on an ARM11
microprocessor core, the
i.MX31 and i.MX31L provide the performance with
low power consumption required by modern digital
devices such as:
Feature-rich cellular phones
Portable media players and mobile gaming
machines
Personal digital assistants (PDAs) and Wireless PDAs
Portable DVD players
Digital cameras
The i.MX31 and i.MX31L take advantage of the
ARM1136JF-S
core running at overdrive speeds of
532 MHz, and are optimized for minimal power
i.MX31 and i.MX31L
Multimedia Applications
Processors
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
1.2 Ordering Information . . . . . . . . . . . . . . . . . . . .3
1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . .4
2 Functional Description and Application
Information
2.1 ARM11 Microprocessor Core . . . . . . . . . . . . . .4
2.2 Module Inventory . . . . . . . . . . . . . . . . . . . . . . .6
3 Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . .9
4 Electrical Characteristics . . . . . . . . . . . . . . . . .10
4.1 i.MX31 and i.MX31L Chip-Level Conditions . .10
4.2 Supply Power-Up/Power-Down Requirements
and Restrictions
4.3 Module-Level Electrical Specifications . . . . . .16
5 Package Information and Pinout . . . . . . . . . . .98
5.1 MAPBGA Production Package . . . . . . . . . . . .98
6 Product Documentation . . . . . . . . . . . . . . . . . .105
6.1 Revision History . . . . . . . . . . . . . . . . . . . . . .106
4
14
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