參數(shù)資料
型號(hào): MCIMX31
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: Multimedia Applications Processors
中文描述: 多媒體應(yīng)用處理器
文件頁數(shù): 1/170頁
文件大小: 1562K
代理商: MCIMX31
Freescale Semiconductor, Inc., 2005, 2006. All rights reserved.
Preliminary
Freescale Semiconductor
Advance Information
This document contains information on a new product. Specifications and information herein are subject to change without notice.
Document Number: MCIMX31
Rev. 1.4, 04/2006
MCIMX31 and
MCIMX31L
Package Information
Plastic Package
Case 1581-01 14 x 14 mm, 0.5 P
Ordering Information
Device
Operating
Temperature Range
0
°
C to +70
°
C
0
°
C to +70
°
C
Package
MCIMX31VKN5
MCIMX31LVKN5
MAPBGA–457
MAPBGA–457
1
Introduction
The i.MX31 (MCIMX31) and i.MX31L (MCIMX31L)
are multimedia applications processors that represent the
next step in low-power, high-performance application
processors. Unless otherwise specified, the material in
this data sheet is applicable to both the i.MX31 and
i.MX31L processors.
Based on an ARM11
microprocessor core, the
i.MX31 and i.MX31L provide the performance with
low power consumption required by modern digital
devices such as:
Feature-rich cellular phones
Portable media players and mobile gaming
machines
Personal digital assistants (PDAs) and Wireless
PDAs
Portable DVD players
Digital cameras
The i.MX31 and i.MX31L take advantage of the
ARM1136JF-S
core running at typical speeds of
532 MHz, and is optimized for minimal power
i.MX31 and i.MX31L
Multimedia Applications
Processors
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . 2
2 Functional Description and Application
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 ARM11 Microprocessor Core . . . . . . . . . . . 3
2.2 Module Inventory . . . . . . . . . . . . . . . . . . . . 5
2.3 Module Descriptions . . . . . . . . . . . . . . . . . . 8
3 Signal Descriptions . . . . . . . . . . . . . . . . . . . 23
3.1 i.MX31 and i.MX31L I/O Pad Signal
Settings . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4 Electrical Characteristics . . . . . . . . . . . . . . 60
4.1 i.MX31 and i.MX31L
Chip-Level Conditions . . . . . . . . . . . . . . . 60
4.2 Supply Power-Up Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . 65
4.3 Module-Level Electrical Specifications . . . 66
5 Package Information and Pinout . . . . . . . 152
5.1 MAPBGA Production Package
457 14 x 14 mm, 0.5 P . . . . . . . . . . . . . . 153
6 Product Documentation . . . . . . . . . . . . . . . 167
6.1 Revision History . . . . . . . . . . . . . . . . . . . 167
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