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參數(shù)資料
| 型號(hào)： | MCIMX31LDVKN5D |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 532 MHz, MICROPROCESSOR, PBGA457 |
| 封裝： | 14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457 |
| 文件頁數(shù)： | 64/118頁 |
| 文件大?。?/td> | 1083K |
| 代理商： | MCIMX31LDVKN5D |
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Functional Description and Application Information
MCIMX31/MCIMX31L Technical Data, Rev. 4.3
Freescale Semiconductor
5
Instruction and data memory management units (MMUs), managed using micro TLB structures
backed by a unified main TLB
Instruction and data L1 caches, including a non-blocking data cache with Hit-Under-Miss
Virtually indexed/physically addressed L1 caches
64-bit interface to both L1 caches
Write buffer (bypassable)
High-speed Advanced Micro Bus Architecture (AMBA) L2 interface
Vector Floating Point co-processor (VFP) for 3D graphics and other floating-point applications
hardware acceleration
ETM and JTAG-based debug support
2.1.1
Memory System
The ARM1136JF-S complex includes 16 KB Instruction and 16 KB Data L1 caches. It connects to the
MCIMX31 L2 unified cache through 64-bit instruction (read-only), 64-bit data read/write (bi-directional),
and 64-bit data write interfaces.
The embedded 16K SRAM can be used for audio streaming data to avoid external memory accesses for
the low-power audio playback, for security, or for other applications. There is also a 32-KB ROM for
bootstrap code and other frequently-used code and data.
A ROM patch module provides the ability to patch the internal ROM. It can also initiate an external boot
by overriding the boot reset sequence by a jump to a configurable address.
Table 2 shows information about the MCIMX31 core in tabular form.
Table 2. MCIMX31 Core
Core
Acronym
Core
Name
Brief Description
Integrated Memory
Includes
ARM11 or
ARM1136
Platform
The ARM1136 Platform consists of the ARM1136JF-S core, the ETM
real-time debug modules, a 6 x 5 multi-layer AHB crossbar switch (MAX), and
a Vector Floating Processor (VFP).
The MCIMX31 provides a high-performance ARM11 microprocessor core and
highly integrated system functions. The ARM Application Processor (AP) and
other subsystems address the needs of the personal, wireless, and portable
product market with integrated peripherals, advanced processor core, and
power management capabilities.
16 Kbyte Instruction
Cache
16 Kbyte Data
Cache
128 Kbyte L2 Cache
32 Kbyte ROM
16 Kbyte RAM
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PDF描述 |
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| MCIMX31LCJKN5D | 32-BIT, 532 MHz, MICROPROCESSOR, PBGA457 |
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| MCIMX511DVK8C | SPECIALTY MICROPROCESSOR CIRCUIT, PBGA625 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCIMX31LDVKN5DR2 | 功能描述:處理器 - 專門應(yīng)用 2.0.1 CONSUMER LITE RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432 |
| MCIMX31LDVMN5D | 功能描述:處理器 - 專門應(yīng)用 2.0.1 CONSUMER LITE RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432 |
| MCIMX31LDVMN5DR2 | 功能描述:處理器 - 專門應(yīng)用 2.0.1 CONSUMER LITE RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432 |
| MCIMX31LITEKIT | 制造商:Freescale Semiconductor 功能描述:I.MX31 LITE KIT 制造商:Rochester Electronics LLC 功能描述: 制造商:Freescale Semiconductor 功能描述:EVAL BOARD FOR 1.MX31 MPV 制造商:Freescale Semiconductor 功能描述:MX31 Lite Kit: High-performance application development kit, Silicon Manufacture |
| MCIMX31LITEKITC | 功能描述:開發(fā)板和工具包 - ARM I.MX31 LITE KIT RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評(píng)估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V |
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