參數(shù)資料
型號(hào)： MCP4726A0T-E/MAY
廠商： Microchip Technology
文件頁(yè)數(shù)： 69/86頁(yè)
文件大?。?/td> 0K
描述： IC DAC 12BIT NV EEP I2C 6DFN
標(biāo)準(zhǔn)包裝： 1
設(shè)置時(shí)間： 6µs
位數(shù)： 12
數(shù)據(jù)接口： EEPROM，I²C，串行
轉(zhuǎn)換器數(shù)目： 1
電壓電源： 單電源
功率耗散（最大）： 1.10W
工作溫度： -40°C ~ 125°C
安裝類型： 表面貼裝
封裝/外殼： 6-VDFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 6-DFN（2x2）
包裝： 標(biāo)準(zhǔn)包裝
輸出數(shù)目和類型： 1 電壓，單極
采樣率（每秒）： *
其它名稱： MCP4726A0T-E/MAYDKR
2011-2012 Microchip Technology Inc.
DS22272C-page 71
MCP4706/4716/4726
8.10
Design Considerations
In the design of a system with the MCP4706/4716/4726
devices, the following considerations should be taken
into account:
8.10.1
POWER SUPPLY
CONSIDERATIONS
The typical application will require a bypass capacitor
in order to filter high-frequency noise, which can be
induced onto the power supply's traces. The bypass
capacitor helps to minimize the effect of these noise
sources on signal integrity. Figure 8-10 illustrates an
appropriate bypass strategy.
In this example, the recommended bypass capacitor
value is 0.1 F. This capacitor should be placed as
close (within 4 mm) to the device power pin (VDD) as
possible.
The power source supplying these devices should be
as clean as possible. If the application circuit has
separate digital and analog power supplies, VDD and
VSS should reside on the analog plane.
FIGURE 8-10:
Typical Microcontroller
Connections.
8.10.2
LAYOUT CONSIDERATIONS
Several layout considerations may be applicable to
your application. These may include:
8.10.2.1
Noise
Inductively-coupled AC transients and digital switching
noise can degrade the input and output signal integrity,
potentially masking the MCP47X6’s performance.
Careful board layout minimizes these effects and
increases the Signal-to-Noise Ratio (SNR). Multi-layer
boards
utilizing a low-inductance ground plane,
isolated inputs, isolated outputs and proper decoupling
are critical to achieving the performance that the silicon
is
capable
of
providing.
Particularly
harsh
environments may require shielding of critical signals.
Separate digital and analog ground planes are
recommended. In this case, the VSS pin and the ground
pins of the VDD capacitors should be terminated to the
analog ground plane.
8.10.2.2
PCB Area Requirements
In some applications, PCB area is a criteria for device
selection.
shows
the
typical
package
dimensions and area for the different package options.
The table also shows the relative area factor compared
to the smallest area. For space critical applications, the
DFN package would be the suggested package.
VDD
VSS
MCP
47X
6
0.1 F
PIC
Mi
croco
n
trolle
r
0.1 F
SCL
VOUT
VREF
SDA
Note:
Breadboards and wire-wrapped boards
are not recommended.
TABLE 8-2:
PACKAGE FOOTPRINT (1)
Package
Package Footprint
Pins
Type
Code
Dimensions
(mm)
Ar
e
a
(m
m
2
)
Re
la
tiv
e
Are
a
Length Width
6
SOT-23
CH
2.90
2.70
7.83
1.96
6
DFN
MAY
2.00
4.00
1
Note 1: Does not include recommended land
pattern
dimensions.
Dimensions
are
typical values.
相關(guān)PDF資料
PDF描述
VI-BTJ-MY-F2 CONVERTER MOD DC/DC 36V 50W
PI5C3244SE IC 8BIT 2PORT BUS SWITCH 20SOIC
PI3C3861QE IC 10-BIT 2-PORT BUS SW 24-QSOP
MS3108E32-7P CONN PLUG 35POS RT ANG W/PINS
VI-BTH-MY-F4 CONVERTER MOD DC/DC 52V 50W
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCP4726A1T-E/CH 功能描述:數(shù)模轉(zhuǎn)換器- DAC Sngl 12B NV DAC w/Ex Vref & I2C interface RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
MCP4726A1T-E/MAY 功能描述:數(shù)模轉(zhuǎn)換器- DAC Sngl 12B NV DAC w/Ex Vref & I2C interface RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
MCP4726A2T-E/CH 功能描述:數(shù)模轉(zhuǎn)換器- DAC Sngl 12B NV DAC w/Ex Vref & I2C interface RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
MCP4726A2T-E/MAY 功能描述:數(shù)模轉(zhuǎn)換器- DAC Sngl 12B NV DAC w/Ex Vref & I2C interface RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
MCP4726A3T-E/CH 功能描述:數(shù)模轉(zhuǎn)換器- DAC Sngl 12B NV DAC w/Ex Vref & I2C interface RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*