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參數(shù)資料
| 型號： | MIP7365-450F17I |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 450 MHz, MICROPROCESSOR, CQFP208 |
| 封裝： | 1.20 X 1.20 MM, CERAMIC, QFP-208 |
| 文件頁數(shù)： | 5/16頁 |
| 文件大小： | 285K |
| 代理商： | MIP7365-450F17I |
13
SCD7365 Rev B 1/11/07
Aeroflex Plainview
Notes
1. All dimensions and tolerancing conform to ANSI Y14.5-1982. Inches are shown in parentheses.
2. Datum plane -H- located at mold parting line and coincident with lead, where lead exits plastic body at
bottom of parting line.
3. Datums A-B and -D- to be determined at centerline between leads where leads exit plastic body at
datum plane -H-.
4. To be determined at seating plane -C-.
5. Dimensions do not include mold protrusion. Allowable mold protrusion is 0.254 mm on dimensions.
6. 216 is the total number of terminals.
7. These dimensions to be determined at datum plane -H-.
8. Package top dimensions are smaller than bottom dimensions and top of package will not overhang
bottom of package.
9. Dimension does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in
excess of the dimension at maximum material condition. Dambar cannot be located on the lower radius or
the foot.
10. Controlling dimension: millimeter.
11. Maximum allowable die thickness to be assembled in this package family is 0.38 mm.
12. This outline conforms to JEDEC publication 95, registration MS-026, variation BGB.
13.
Defined as the distance from the seating plane to the lowest point of the package body.
14. Exposed pad shall be coplanar with bottom of package within 0.05.
15.
Corner chamfer of exposed die pad shall be within 0.30 mm.
MIP7365 216-PIN EPad LQFP PACKAGE OUTLINE NOTES
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