
ML2264
2
PIN# NAME
FUNCTION
PIN# NAME
FUNCTION
1
A IN 4
Analog input 4.
2
A IN 3
Analog input 3.
3
A IN 2
Analog input 2.
4
A IN 1
Analog input 1.
5
MODE
Mode select input.
MODE = GND: RD mode
MODE = V
CC
: WR-RD mode
Pin has internal current source
pulldown to GND.
6
DB0
Data output — bit 0 (LSB).
7
DB1
Data output — bit 1.
8
DB2
Data output — bit 2.
8
DB3
RD
Data output — bit 3.
10
Read input. In RD mode, this pin
initiates a conversion. In WR-RD
mode, this pin latches data into output
latches. See Digital Interface section.
11
INT
Interrupt output. This output signals
the end of a conversion and indicates
that data is valid on the data outputs.
See Digital Interface section.
12
GND
Ground.
13
–V
REF
Negative reference voltage for
A/D converter.
14
+V
REF
Positive reference voltage for
A/D converter.
PIN DESCRIPTION
15
WR
/RDY
Write input or ready output. In WR-RD
mode, this pin is
WR
input. In RD
mode, this pin is RDY open drain
output. See Digital Interface section.
16
CS
Chip select input. This pin must be
held low for the device to perform a
conversion.
17
DB4
Data output — bit 4.
18
DB5
Data output — bit 5.
19
DB6
Data output — bit 6.
20
DB7
Data output — bit 7 (MSB).
21
A1
Digital address input 1 that selects
analog input channel. See multiplexer
addressing section.
22
A0
Digital address input 0 that selects
analog input channel. See multiplexer
addressing section.
23
SH/
TH
S/H, T/H mode select. When SH/
TH
=
V
CC
, the device is in sample and hold
mode. When SH/
TH
= GND, the
device is in track and hold mode. Pin
has internal pulldown current source
to GND.
24
V
CC
Positive supply. +5 volts ± 5%.
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings are those values beyond which
the device could be permanently damaged. Absolute
maximum ratings are stress ratings only and functional
device operation is not implied.
Supply Voltage, V
CC
.................................................6.5V
Voltage
Logic Inputs ................................. –0.3V to V
CC
+ 0.3V
Analog Inputs .............................. –0.3V to V
CC
+ 0.3V
Input Current per Pin (Note 2) ..............................±25mA
Storage Temperature..............................–65°C to +150°C
Package Dissipation
at T
A
= 25°C (Board Mount) .............................875mW
Lead Temperature (Soldering 10 sec.)
Dual-In-Line Package (Plastic)............................ 260°C
Dual-In-Line Package (Ceramic)......................... 300°C
SOIC
Vapor Phase (60 sec.) ..................................... 215°C
Infrared (15 sec.) ............................................ 220°C
OPERATING CONDITIONS
Supply Voltage, V
CC
............................ 4.5V
DC
to 6.0V
DC
Temperature Range (Note 3) ................. T
MIN
- T
A
- T
MAX
ML2264CCS
ML2264CCP
ML2264CCR........................................... 0°C to +70°C