參數(shù)資料
型號(hào)： MPC106ARX83DG
廠商： MOTOROLA INC
元件分類： 總線控制器
英文描述： PCI Bridge/Memory Controller
中文描述： PCI BUS CONTROLLER, CBGA304
封裝： 21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-304
文件頁數(shù)： 25/28頁
文件大小： 158K
代理商： MPC106ARX83DG
MPC106 PCI Bridge/Memory Controller Hardware Specifications
25
System Design Information
Figure 14. Exploded Cross-Sectional View
1.8.5.1 Internal Package Conduction Resistance
For this C4/CBGA packaging technology, the intrinsic conduction thermal resistance paths are as follows:
The die junction-to-case thermal resistance
The die junction-to-lead thermal resistance
These parameters are shown in Table 13. In this C4/CBGA package, the silicon chip is exposed; therefore,
the package “case” is the top of the silicon.
Figure 15 provides a simplified thermal network in which a C4/CBGA package is mounted to a
printed-circuit board.
Figure 15. C4/CBGA Package Mounted to a Printed-Circuit Board
Table 13. Thermal Resistance
Thermal Metric
Effective Thermal Resistance
Junction-to-case thermal resistance
0.133 °C/W
Junction-to-lead (ball) thermal resistance
3.8 °C/W
Chip with C4 Encapsulant
Ceramic Substrate
CBGA Joint
Printed-Circuit Board
External Resistance
External Resistance
Internal Resistance
(Note the internal versus external package resistance)
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
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