參數(shù)資料
型號: MPC106ARX83DG
廠商: MOTOROLA INC
元件分類: 總線控制器
英文描述: PCI Bridge/Memory Controller
中文描述: PCI BUS CONTROLLER, CBGA304
封裝: 21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-304
文件頁數(shù): 4/28頁
文件大?。?/td> 158K
代理商: MPC106ARX83DG
4
MPC106 PCI Bridge/Memory Controller Hardware Specifications
Features
Secondary (L2) cache control
— Configurable for write-through or write-back operation
— Supports cache sizes of 256 Kbytes, 512 Kbytes, and 1 Mbyte
— Up to 4 Gbytes of cacheable space
— Direct-mapped
— Supports byte parity
— Supports partial update with external byte decode for write enables
— Programmable interface timing
— Supports pipelined burst, synchronous burst, or asynchronous SRAMs
— Alternately supports an external L2 cache controller or integrated L2 cache module
Memory interface
— 1 Gbyte of RAM space, 16 Mbytes of ROM space
— Supports parity or error checking and correction (ECC)
— High-bandwidth, 64-bit data bus (72 bits including parity or ECC)
— Supports fast page mode DRAMs, extended data out (EDO) DRAMs, and synchronous
DRAMs (SDRAMs)
— Supports 1 to 8 banks of DRAM/EDO/SDRAM with sizes ranging from 2 Mbyte to
128 Mbytes per bank
— ROM space may be split between the PCI bus and the 60x/memory bus (8 Mbytes each)
— Supports 8-bit asynchronous ROM or 64-bit burst-mode ROM
— Supports writing to Flash ROM
— Configurable external buffer control logic
— Programmable interface timing
PCI interface
— Compliant with
PCI Local Bus Specification,
— Supports PCI interlocked accesses to memory using LOCK signal and protocol
— Supports accesses to all PCI address spaces
— Selectable big- or little-endian operation
— Store gathering on PCI writes to memory
— Selectable memory prefetching of PCI read accesses
— Only one external load presented by the MPC106 to the PCI bus
— Interface operates at 20–33 MHz
— Word parity supported
— 3.3 V/5.0 V-compatible
Support for concurrent transactions on 60x and PCI buses
Power management
— Fully-static 3.3-V CMOS design
— Supports 60x nap, doze, and sleep power management modes and suspend mode
IEEE 1149.1-compliant, JTAG boundary-scan interface
304-pin ceramic ball grid array (CBGA) package
Revision 2.1
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