參數(shù)資料
型號: MPC603EFE133LX
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 133 MHz, RISC PROCESSOR, CQFP240
封裝: 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
文件頁數(shù): 7/32頁
文件大?。?/td> 149K
代理商: MPC603EFE133LX
PID6-603e Hardware Specifications, Rev 2
15
1.5.2 Pinout Diagram for the CBGA Package
Figure 10
(in part A) shows the pinout of the CBGA package as viewed from the top surface. Part B
shows the side profile of the CBGA package to indicate the direction of the top surface view.
Part A
Figure 10. Pinout of the CBGA Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04
05 06 07 08
09 10
11 12 13
14
15 16
Not to Scale
View
Part B
Die
Substrate Assembly
Encapsulant
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