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參數(shù)資料
| 型號： | MPC603ERX133TX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 133 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 19/32頁 |
| 文件大?。?/td> | 149K |
| 代理商： | MPC603ERX133TX |
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PID6-603e Hardware Specifications, Rev 2
During inactive periods on the bus, the address and transfer attributes on the bus are not driven by any master
and may oat in the high-impedance state for relatively long periods of time. Since the 603e must
continually monitor these signals for snooping, this oat condition may cause excessive power draw by the
input receivers on the 603e. It is recommended that these signals be pulled up through weak (10 KOhms)
pull-up resistors or restored in some manner by the system. The snooped address and transfer attribute inputs
are—A[0–31], AP[0–3], TT[0–4], TBST, TSIZ[0–2], and GBL.
The data bus input receivers are normally turned off when no read operation is in progress and do not require
pull-up resistors on the data bus.
1.8.6 Thermal Management Information
This section provides thermal management information for the ceramic quad-at package (CQFP) and the
ceramic ball grid array (CBGA) package for air-cooled applications. Proper thermal control design is
primarily dependent upon the system-level design—the heat sink, airow and thermal interface material. To
reduce the die-junction temperature, heat sinks may be attached to the package by several methods—
adhesive, spring clip to holes in the printed-circuit board or package, and mounting clip and screw assembly
(CBGA package); see Figure 14. This spring force should not exceed 5.5 pounds of force.
Figure 14. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the 603e. There are several
commercially-available heat sinks for the 603e provided by the following vendors:
Chip Coolers Inc.
800-227-0254 (USA/Canada)
333 Strawberry Field Rd.
401-739-7600
Warwick, RI 02887-6979
International Electronic Research Corporation (IERC)
818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Adhesive
WB/C4-CQFP Package
or
Thermal Interface Material
Heat Sink
CBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC603RRX200LC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX200TC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX266LC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX266TC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX300LC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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