參數(shù)資料
型號: MPC603ERX133TX
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 133 MHz, RISC PROCESSOR, CBGA255
封裝: 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁數(shù): 28/32頁
文件大小: 149K
代理商: MPC603ERX133TX
PID6-603e Hardware Specifications, Rev 2
5
Table 2 provides the recommended operating conditions for the 603e.
Table 3 provides the packages thermal characteristics for the 603e.
Table 4 provides the DC electrical characteristics for the 603e.
Table 2. Recommended Operating Conditions
Characteristic
Symbol
Value
Unit
Notes
Core supply voltage
Vdd
3.3 ± 165mv
V
PLL supply voltage
AVdd
3.3 ± 165mv
V
I/O supply voltage
OVdd
3.3 ± 165mv
V
Input voltage
Vin
-0.3 to 5.5
V
Die-junction temperature
Tj
0 to 105
°C
2
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
2. The extended temperature parts have die-junction temperature of -40 to 105 °C.
Table 3. Package Thermal Characteristics
Characteristic
Symbol
Value
Rating
Wire-bond CQFP package die junction-to-case thermal resistance
(typical)
θ
JC
2.2
°C/W
Wire-bond CQFP package die junction-to-lead thermal resistance
(typical)
θ
JB
18.0
°C/W
CBGA package die junction-to-case thermal resistance (typical)
θ
JC
0.08
°C/W
CBGA package die junction-to-ball thermal resistance (typical)
θ
JB
2.8
°C/W
Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management.
Table 4. DC Electrical Specifications
At recommended operating conditions. See Table 2.
Characteristic
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except SYSCLK)
VIH
2.0
5.5
V
Input low voltage (all inputs except SYSCLK)
VIL
-0.3
0.8
V
SYSCLK input high voltage
CVIH
2.4
5.5
V
SYSCLK input low voltage
CVIL
-0.3
0.4
V
Input leakage current, Vin = 3.465 V
Vin = 5.5 V
Iin
—10
A
1
Iin
245
A
1
Hi-Z (off-state) leakage current, Vin = 3.465 V
Vin = 5.5 V
ITSI
—10
A
1
ITSI
245
A
1
Output high voltage, IOH = –9 mA
VOH
2.4
V
1
Output low voltage, IOL = 14 mA
VOL
0.4
V
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