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參數(shù)資料
| 型號： | MPC603ERX133TX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 133 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 27/32頁 |
| 文件大小： | 149K |
| 代理商： | MPC603ERX133TX |
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4
PID6-603e Hardware Specifications, Rev 2
Integrated power management
— Low-power 3.3-volt design
— Internal processor/bus clock multiplier that provides 1/1, 1.5/1, 2/1, 2.5/1, 3/1, 3.5/1, and 4/1
ratios
— Three power saving modes: doze, nap, and sleep
— Automatic dynamic power reduction when internal functional units are idle
In-system testability and debugging features through JTAG boundary-scan capability
1.3 General Parameters
The following list provides a summary of the general parameters of the 603e.
Technology
0.5 CMOS, four-layer metal
Die size
11.67 mm x 8.4 mm (98 mm
2)
Transistor count
2.6 million
Logic design
Fully-static
Package
Surface mount 240-pin ceramic quad at pack (CQFP)
or 255-pin ceramic ball grid array (CBGA)
Power supply
3.3 ± 5% V dc
1.4 Electrical and Thermal Characteristics
This section provides the AC and DC electrical specications and thermal characteristics for the 603e.
1.4.1 DC Electrical Characteristics
The tables in this section describe the 603e DC electrical characteristics. Table 1 provides the absolute
maximum ratings.
Table 1. Absolute Maximum Ratings
Characteristic
Symbol
Value
Unit
Core supply voltage
Vdd
–0.3 to 4.0
V
PLL supply voltage
AVdd
–0.3 to 4.0
V
I/O supply voltage
OVdd
–0.3 to 4.0
V
Input voltage
Vin
–0.3 to 5.5
V
Storage temperature range
Tstg
–55 to 150
°C
Notes:
1. Functional operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and
functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device
reliability or cause permanent damage to the device.
2. Caution: Vin must not exceed OVdd by more than 2.5 V at any time including during power-on reset.
3. Caution: OVdd must not exceed Vdd/AVdd by more than 2.5 V at any time including during power-on reset.
4. Caution: Vdd/AVdd must not exceed OVdd by more than 0.4 V at any time including during power-on reset.
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| MPC603RRX200LC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX200TC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX266LC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX266TC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX300LC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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