參數(shù)資料
型號(hào)： MPC603ERX133TX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 133 MHz, RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁(yè)數(shù)： 20/32頁(yè)
文件大?。?/td> 149K
代理商： MPC603ERX133TX
PID6-603e Hardware Specifications, Rev 2
27
Thermalloy
214-243-4321
2021 W. Valley View Lane
P.O. Box 810839
Dallas, TX 75731
Wakeeld Engineering
617-245-5900
60 Audubon Rd.
Wakeeld, MA 01880
Aavid Engineering
603-528-3400
One Kool Path
Laconia, NH 03247-0440
Ultimately, the nal selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
1.8.6.1 Internal Package Conduction Resistance
For this packaging technology the intrinsic thermal conduction resistance (shown in Table 3) versus the
external thermal resistance paths are shown in Figure 15 for a package with an attached heat sink mounted
to a printed-circuit board.
Figure 15. Package with Heat Sink Mounted to a Printed-Circuit Board
1.8.6.2 Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 16 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
graphite/oil, oroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact pressure.
The use of thermal grease signicantly reduces the interface thermal resistance. That is, the bare joint results
in a thermal resistance approximately 7 times greater than the thermal grease joint.
External Resistance
Internal Resistance
(Note the internal versus external package resistance)
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
相關(guān)PDF資料
PDF描述
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC603RRX200LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX200TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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