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參數(shù)資料
| 型號： | MPC603PFE233LX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 233 MHz, RISC PROCESSOR, CQFP240 |
| 封裝： | 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 |
| 文件頁數(shù)： | 28/40頁 |
| 文件大小： | 156K |
| 代理商： | MPC603PFE233LX |
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34
PID7v-603e Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Where:
Ta is the ambient temperature in the vicinity of the device
Rθja is the junction-to-ambient thermal resistance
Rθjs is the junction-to-heat sink thermal resistance (includes thermal grease or thermal adhesive)
Rsa is the heat sink-to-ambient thermal resistance
P is the power dissipated by the device
Note: Rθjs includes the resistance of a typical layer of thermal compound. If a lower conductivity material
is used, its thermal resistance must be included.
In this environment, it can be assumed that all the heat is dissipated to the ambient through the heat sink, so
the junction-to-ambient thermal resistance is the sum of the resistances from the junction to the heat sink
and from the heat sink to the ambient.
Note that verication of external thermal resistance and case temperature should be performed for each
application. Thermal resistance can vary considerably due to many factors including degree of air
turbulence.
Figure 16 provides a thermal management example for the IBM C4-CQFP package.
Figure 16. IBM C4-CQFP Thermal Management Example
For a power dissipation of 2.5 Watts in an ambient temperature of 40
°C at 1 m/sec with the pinn heat sink
measured above, the junction temperature of the device is as follows:
Tj = Ta + Rθja * P
Tj = 40 °C + (9.1 °C/Watt * 2.5 Watts) = 63 °C
which is well within the reliability limits of the device.
Forced Convection (m/sec)
0
5
10
15
20
25
30
35
40
0
0.25
0.5
1
2
Exposed Die
Aluminum
Plate
Pinfin
Junction-to-Ambient
Thermal
Resistance
(°C/W)
IBM C4-CQFP
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| MPC603RRX200LC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX200TC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX266LC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX266TC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX300LC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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