參數(shù)資料
型號(hào)： MPC603PFE233LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 233 MHz, RISC PROCESSOR, CQFP240
封裝： 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
文件頁(yè)數(shù)： 36/40頁(yè)
文件大?。?/td> 156K
代理商： MPC603PFE233LX
PID7v-603e Hardware Specifications
5
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Table 2 provides the recommended operating conditions for the PID7v-603e.
Table 3 provides the package thermal characteristics for the PID7v-603e.
Table 1. Absolute Maximum Ratings
Characteristic
Symbol
Value
Unit
Core supply voltage
Vdd
–0.3 to 2.75
V
PLL supply voltage
AVdd
–0.3 to 2.75
V
I/O supply voltage
OVdd
–0.3 to 3.6
V
Input voltage
Vin
–0.3 to 5.5
V
Storage temperature range
Tstg
–55 to 150
°C
Notes:
1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings
only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect
device reliability or cause permanent damage to the device.
2. Caution: Vin must not exceed OVdd by more than 2.5 V at any time, including during power-on reset.
3. Caution: OVdd must not exceed Vdd/AVdd by more than 1.2 V at any time, including during power-on reset.
4. Caution: Vdd/AVdd must not exceed OVdd by more than 0.4 V at any time, including during power-on reset.
Table 2. Recommended Operating Conditions
Characteristic
Symbol
Value
Unit
Core supply voltage
Vdd
2.375 to 2.625
V
PLL supply voltage
AVdd
2.375 to 2.625
V
I/O supply voltage
OVdd
3.135 to 3.465
V
Input voltage
Vin
GND to 5.5
V
Junction temperature
Tj
0 to 105
°C
Note: These are the recommended and tested operating conditions. Proper device operation outside of
these conditions is not guaranteed.
Table 3. Thermal Characteristics
Characteristic
Symbol
Value
Rating
Motorola wire-bond CQFP package thermal resistance, junction-to-case (typical)
θ
JC
2.2
°C/W
IBM C4-CQFP package thermal resistance, junction-to-case
θ
JC
3.6
°C/W
BGA package thermal resistance, junction-to-top-of-die
θ
JC
0.03
°C/W
Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management.
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