參數(shù)資料
型號(hào)： MPC8245TZU300D
廠(chǎng)商： Freescale Semiconductor
文件頁(yè)數(shù)： 5/68頁(yè)
文件大?。?/td> 0K
描述： IC MPU 32BIT 300MHZ 352-TBGA
標(biāo)準(zhǔn)包裝： 24
系列： MPC82xx
處理器類(lèi)型： 32-位 MPC82xx PowerQUICC II
速度： 300MHz
電壓： 1.8V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 352-LBGA
供應(yīng)商設(shè)備封裝： 352-TBGA（35x35）
包裝： 托盤(pán)
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
13
Electrical and Thermal Characteristics
4.4
Thermal Characteristics
Table 6 provides the package thermal characteristics for the MPC8245. For details, see Section 7.8,
4.5
AC Electrical Characteristics
After fabrication, functional parts are sorted by maximum processor core frequency as shown in Table 7
and tested for conformance to the AC specifications for that frequency. The processor core frequency is
determined by the bus (PCI_SYNC_IN) clock frequency and the settings of the PLL_CFG[0:4] signals.
Parts are sold by maximum processor core frequency. See Section 9, “Ordering Information,” for details
on ordering parts.
Table 6. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection
(Single-layer board—1s)
RθJA
16.1
°C/W
1, 2
Junction-to-ambient natural convection
(Four-layer board—2s2p)
RθJMA
12.0
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
(Single-layer board—1s)
RθJMA
11.6
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
(Four layer board—2s2p)
RθJMA
9.0
°C/W
1, 3
Junction-to-board
RθJB
4.8
°C/W
4
Junction-to-case
RθJC
1.8
°C/W
5
Junction-to-package top (natural convection)
ΨJT
1.0
°C/W
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1) with the cold plate used for case temperature.
6. Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
相關(guān)PDF資料
PDF描述
MPC8245TVV300D IC MPU 32BIT 300MHZ PPC 352-TBGA
MPC8378VRANGA MPU POWERQUICC II 800MHZ 689PBGA
MPC8377VRANGA MPU POWERQUICC II 800MHZ 689PBGA
MPC866TVR100A IC MPU POWERQUICC 100MHZ 357PBGA
IDT709159L7BF IC SRAM 72KBIT 7NS 100FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8245TZU333D 功能描述:微處理器 - MPU 333MHz 632.7MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8245TZU350D 功能描述:微處理器 - MPU 350MHz 665MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8247 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:MPC8272 PowerQUICC II Family Hardware Specifications
MPC8247CVR 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:MPC8272 PowerQUICC II Family Hardware Specifications
MPC8247CVRB 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠(chǎng)商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*