參數(shù)資料
型號： MPC8349CZUAJFB
廠商： Freescale Semiconductor
文件頁數(shù)： 74/87頁
文件大?。?/td> 0K
描述： IC MPU POWERQUICC II PRO 672TBGA
標(biāo)準(zhǔn)包裝： 24
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 533MHz
電壓： 1.2V
安裝類型： 表面貼裝
封裝/外殼： 672-LBGA
供應(yīng)商設(shè)備封裝： 672-TBGA（35x35）
包裝： 托盤
配用： MPC8349E-MITX-GP-ND - KIT REFERENCE PLATFORM MPC8349E
MPC8349E-MITXE-ND - BOARD REFERENCE FOR MPC8349
MPC8349EA-MDS-PB-ND - KIT MODULAR DEV SYSTEM MPC8349E
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
76
Freescale Semiconductor
Thermal
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TA + (RθJA × PD)
where:
TJ = junction temperature (°C)
TA = ambient temperature for the package (°C)
RθJA = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
20.2.3
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, use
the thermal characterization parameter (
Ψ
JT) to determine the junction temperature and a measure of the
temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
TJ = junction temperature (°C)
TT = thermocouple temperature on top of package (°C)
Ψ
JT = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per the JESD51-2 specification using a 40 gauge type
T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
20.2.4
Heat Sinks and Junction-to-Case Thermal Resistance
Some application environments require a heat sink to provide the necessary thermal management of the
device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case
thermal resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
相關(guān)PDF資料
PDF描述
1734798-6 CONN HOUSING FPC 6POS R/A SMD
54550-0894 CONN FPC 8POS .5MM SMD R/A ZIF
356-006-500-101 CARDEDGE 6POS .156 BLACK
345-010-542-804 CARDEDGE 10POS DUAL .100 GREEN
345-010-542-802 CARDEDGE 10POS DUAL .100 GREEN
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8349CZUALDB 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MPC8349CZUALFB 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MPC8349E 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC⑩ II Pro Integrated Host Processor Hardware Specifications
MPC8349E_07 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC⑩ II Pro Integrated Host Processor Hardware Specifications
MPC8349EA-MDS 功能描述:開發(fā)板和工具包 - 其他處理器 MODULAR DEV SYSTEM RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
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