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| 型號(hào)： | MPC8378EVRANFA |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 333 MHz, MICROPROCESSOR, PBGA689 |
| 封裝： | 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-689 |
| 文件頁(yè)數(shù)： | 21/125頁(yè) |
| 文件大?。?/td> | 894K |
| 代理商： | MPC8378EVRANFA |
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MPC8378E PowerQUICC II Pro Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
117
Tyco Electronics
Chip Coolers
www.chipcoolers.com
Wakefield Engineering
www.wakefield.com
Interface material vendors include the following:
Chomerics, Inc.
www.chomerics.com
Dow-Corning Corporation
Dow-Corning Electronic Materials
www.dowcorning.com
Shin-Etsu MicroSi, Inc.
www.microsi.com
The Bergquist Company
www.bergquistcompany.com
23.3
Heat Sink Attachment
The device requires the use of heat sinks. When heat sinks are attached, an interface material is required, preferably thermal
grease and a spring clip. The spring clip should connect to the printed circuit board, either to the board itself, to hooks soldered
to the board, or to a plastic stiffener. Avoid attachment forces that can lift the edge of the package or peel the package from the
board. Such peeling forces reduce the solder joint lifetime of the package. The recommended maximum compressive force on
the top of the package is 10 lb force (4.5 kg force). Any adhesive attachment should attach to painted or plastic surfaces, and
its performance should be verified under the application requirements.
23.3.1
Experimental Determination of the Junction Temperature with a Heat
Sink
When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the interface between the case
of the package and the interface material. A clearance slot or hole is normally required in the heat sink. Minimize the size of
the clearance to minimize the change in thermal performance caused by removing part of the thermal interface to the heat sink.
Because of the experimental difficulties with this technique, many engineers measure the heat sink temperature and then back
calculate the case temperature using a separate measurement of the thermal resistance of the interface. From this case
temperature, the junction temperature is determined from the junction to case thermal resistance.
TJ = TC + (RJC PD)
where:
TJ = junction temperature (C)
TC = case temperature of the package (C)
RJC = junction to case thermal resistance (C/W)
PD = power dissipation (W)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8378EVRANG | 功能描述:微處理器 - MPU 837X Encyrpted RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8378EVRANGA | 功能描述:微處理器 - MPU 8378 PBGA ST PbFr W/ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8378EZQAFDA | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8378EZQAFFA | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8378EZQAFGA | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
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