參數(shù)資料
型號： MPC8378VRANGA
廠商： Freescale Semiconductor
文件頁數(shù)： 20/128頁
文件大?。?/td> 0K
描述： MPU POWERQUICC II 800MHZ 689PBGA
標(biāo)準(zhǔn)包裝： 27
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 800MHz
電壓： 1.05V
安裝類型： 表面貼裝
封裝/外殼： 689-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝： 689-TEPBGA II（31x31）
包裝： 托盤
MPC8378E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
116
Freescale Semiconductor
23.2
Thermal Management Information
For the following sections, PD = (VDD × IDD) + PI/O where PI/O is the power dissipation of the I/O drivers.
23.2.1
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TJ = junction temperature (°C)
TA = ambient temperature for the package (°C)
RθJA = junction to ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The junction to ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Generally, the value obtained on a single layer board is appropriate for
a tightly packed printed circuit board. The value obtained on the board with the internal planes is usually
appropriate if the board has low power dissipation and the components are well separated. Test cases have
demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible.
23.2.2
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
NOTE
The heat sink cannot be mounted on the package.
Junction-to-package natural convection on top
ψJT
6
°C/W
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
Table 77. Package Thermal Characteristics for TePBGA II (continued)
Parameter
Symbol
Value
Unit
Note
相關(guān)PDF資料
PDF描述
MPC8377VRANGA MPU POWERQUICC II 800MHZ 689PBGA
MPC866TVR100A IC MPU POWERQUICC 100MHZ 357PBGA
IDT709159L7BF IC SRAM 72KBIT 7NS 100FBGA
IDT70V9359L7PF8 IC SRAM 144KBIT 7NS 100TQFP
MPC860ENZQ50D4R2 IC MPU PWRQUICC 50MHZ 357-PBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8378ZQAFDA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8378ZQAFFA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8378ZQAFGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8378ZQAGDA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8378ZQAGFA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*