參數(shù)資料
型號: MPC8379ECVRANGA
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 400 MHz, MICROPROCESSOR, PBGA689
封裝: 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-689
文件頁數(shù): 9/114頁
文件大小: 1337K
代理商: MPC8379ECVRANGA
MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
106
Freescale Semiconductor
Thermal
Table 78 shows the heat sink thermal resistance for TePBGA II package with heat sinks, simulated in a
standard JEDEC environment, per JESD 51-6.
Heat sink vendors include the following:
Aavid Thermalloy
www.aavidthermalloy.com
Alpha Novatech
www.alphanovatech.com
International Electronic Research Corporation (IERC)
www.ctscorp.com
Millennium Electronics (MEI)
www.mei-thermal.com
Table 78. Thermal Resistance with Heat Sink in Open Flow (TePBGA II)
Heat Sink Assuming Thermal Grease
Air Flow
Thermal Resistance
(
°/W)
AAVID 30
× 30 × 9.4 mm Pin Fin
Natural Convection
13.1
0.5 m/s
10.6
1 m/s
9.3
2 m/s
8.2
4 m/s
7.5
AAVID 31
× 35 × 23 mm Pin Fin
Natural Convection
11.1
0.5 m/s
8.5
1 m/s
7.7
2 m/s
7.2
4 m/s
6.8
AAVID 43
× 41× 16.5mm Pin Fin
Natural Convection
11.3
0.5 m/s
9.0
1 m/s
7.8
2 m/s
7.0
4 m/s
6.5
Wakefield, 53
× 53 × 25 mm Pin Fin
Natural Convection
9.7
0.5 m/s
7.7
1 m/s
6.8
2 m/s
6.4
4 m/s
6.1
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