參數(shù)資料
型號: MPC8544AVTAQG
廠商: Freescale Semiconductor
文件頁數(shù): 99/117頁
文件大小: 0K
描述: IC MPU POWERQUICC III 783-FCBGA
標(biāo)準(zhǔn)包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.0GHz
電壓: 1V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
配用: MPC8544DS-ND - BOARD DEVELOPMENT SYSTEM 8544
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6
82
Freescale Semiconductor
Package Description
18.2
Mechanical Dimensions of the MPC8544E FC-PBGA
Figure 59 shows the mechanical dimensions and bottom surface nomenclature of the MPC8544E,
783 FC-PBGA package without a lid.
Figure 59. Mechanical Dimensions and Bottom Surface Nomenclature
of the MPC8544E FC-PBGA without a Lid
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
6. Capacitors may not be present on all parts. Care must be taken not to short exposed metal capacitor pads.
7. All dimensions are symmetric across the package center lines, unless dimensioned otherwise.
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