參數(shù)資料
型號: MRF6S27015GNR1
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: RF Power Field Effect Transistors
中文描述: 射頻功率場效應(yīng)晶體管
文件頁數(shù): 2/17頁
文件大小: 552K
代理商: MRF6S27015GNR1
2
RF Device Data
Freescale Semiconductor
MRF6S27015NR1 MRF6S27015GNR1
Table 3. ESD Protection Characteristics
Test Methodology
Class
Human Body Model (per JESD22-A114)
1A (Minimum)
Machine Model (per EIA/JESD22-A115)
A (Minimum)
Charge Device Model (per JESD22-C101)
IV (Minimum)
Table 4. Moisture Sensitivity Level
Test Methodology
Rating
Package Peak Temperature
Unit
Per JESD 22-A113, IPC/JEDEC J-STD-020
3
260
°
C
Table 5. Electrical Characteristics
(T
C
= 25
°
C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Off Characteristics
Zero Gate Voltage Drain Leakage Current
(V
DS
= 68
Vdc, V
GS
= 0 Vdc)
I
DSS
10
μ
Adc
Zero Gate Voltage Drain Leakage Current
(V
DS
= 28
Vdc, V
GS
= 0 Vdc)
I
DSS
1
μ
Adc
Gate-Source Leakage Current
(V
GS
= 5 Vdc, V
DS
= 0 Vdc)
I
GSS
500
nAdc
On Characteristics
Gate Threshold Voltage
(V
DS
= 10 Vdc, I
D
= 40
μ
Adc)
V
GS(th)
1.5
2.2
3.5
Vdc
Gate Quiescent Voltage
(V
DS
= 28 Vdc, I
D
= 160 mAdc)
Fixture Gate Quiescent Voltage
(1)
(V
DD
= 28 Vdc, I
D
= 160 mAdc, Measured in Functional Test)
V
GS(Q)
2.8
Vdc
V
GG(Q)
2.2
3.1
4.4
Vdc
Drain-Source On-Voltage
(V
GS
= 10 Vdc, I
D
= 0.4 Adc)
V
DS(on)
0.27
0.4
Vdc
Dynamic Characteristics
(2)
Reverse Transfer Capacitance
(V
DS
= 28
Vdc
±
30 mV(rms)ac @ 1 MHz, V
GS
= 0 Vdc)
C
rss
11.6
pF
Output Capacitance
(V
DS
= 28
Vdc
±
30 mV(rms)ac @ 1 MHz, V
GS
= 0 Vdc)
C
oss
22.9
pF
Functional Tests
(In Freescale Test Fixture, 50 ohm system) V
DD
= 28 Vdc, I
DQ
= 160 mA, P
out
= 3 W Avg., f = 2600 MHz, Single-Carrier
W-CDMA, 3.84 MHz Channel Bandwidth Carriers. ACPR measured in 3.84 MHz Channel Bandwidth @
±
5 MHz Offset. PAR = 8.5 dB @
0.01% Probability on CCDF.
Power Gain
G
ps
η
D
12.5
14
16
dB
Drain Efficiency
19
22
%
Adjacent Channel Power Ratio
ACPR
-45
-42
dBc
Input Return Loss
IRL
-18
-9
dB
1. V
GG
= 11/10 x V
GS(Q)
. Parameter measured on Freescale Test Fixture, due to resistive divider network on the board. Refer to Test Circuit
schematic.
2. Part internally input matched.
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