參數(shù)資料
型號(hào): MRF6V2150N
廠商: 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述: N-Channel Enhancement-Mode Lateral MOSFETs
中文描述: N溝道增強(qiáng)型MOSFET的外側(cè)
文件頁數(shù): 2/8頁
文件大?。?/td> 212K
代理商: MRF6V2150N
2
RF Device Data
Freescale Semiconductor
MRF6V2150N MRF6V2150NB
Table 3. ESD Protection Characteristics
Test Methodology
Class
Human Body Model (per JESD22-A114)
TBD (Minimum)
Machine Model (per EIA/JESD22-A115)
TBD (Minimum)
Charge Device Model (per JESD22-C101)
TBD (Minimum)
Table 4. Moisture Sensitivity Level
Test Methodology
Rating
Package Peak Temperature
Unit
Per JESD 22-A113, IPC/JEDEC J-STD-020
3
260
°
C
Table 5. Electrical Characteristics
(T
C
= 25
°
C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Off Characteristics
Zero Gate Voltage Drain Leakage Current
(V
DS
= 110
Vdc, V
GS
= 0 Vdc)
I
DSS
10
μ
Adc
Zero Gate Voltage Drain Leakage Current
(V
DS
= 50 Vdc, V
GS
= 0 Vdc)
I
DSS
10
μ
Adc
Drain-Source Breakdown Voltage
(I
D
= 75 mA, V
GS
= 0 Vdc)
BV
DSS
110
Vdc
Gate-Source Leakage Current
(V
GS
= 5 Vdc, V
DS
= 0 Vdc)
I
GSS
10
μ
Adc
On Characteristics
Gate Threshold Voltage
(V
DS
= 10 Vdc, I
D
= 400
μ
Adc)
V
GS(th)
2.4
Vdc
Drain-Source On-Voltage
(V
GS
= 10 Vdc, I
D
= 1
Adc)
V
DS(on)
0.3
Vdc
Dynamic Characteristics
Reverse Transfer Capacitance
(V
DS
= 50 Vdc, V
GS
= 0 Vdc, f = 1.0 MHz)
C
rss
1.54
pF
Output Capacitance
(V
DS
= 50 Vdc, V
GS
= 0 Vdc, f = 1.0 MHz)
C
oss
94
pF
Input Capacitance
(V
DS
= 50 Vdc, V
GS
= 0 Vdc, f = 1.0 MHz)
C
iss
163
pF
Functional Tests
(In Freescale Test Fixture, 50
ο
hm system) V
DD
= 50 Vdc, I
DQ
= 450 mA, P
out
= 150 W, f = 220 MHz, CW
Power Gain
G
ps
η
D
25.5
dB
Drain Efficiency
69
%
Input Return Loss
IRL
-17
dB
P
out
@ 1 dB Compression Point, CW
(f = 220 MHz)
P1dB
165
W
ATTENTION: The MRF6V2150N and MRF6V2150NB are high power devices and special considerations
must be followed in board design and mounting. Incorrect mounting can lead to internal temperatures which
exceed the maximum allowable operating junction temperature. Refer to Freescale Application Note AN3263
(for bolt down mounting) or AN1907 (for solder reflow mounting)
PRIOR TO STARTING SYSTEM DESIGN
to
ensure proper mounting of these devices.
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