參數(shù)資料
型號(hào): MSP430F1101IPWR
廠商: TEXAS INSTRUMENTS INC
元件分類: 微控制器/微處理器
英文描述: 16-BIT, FLASH, 8 MHz, RISC MICROCONTROLLER, PDSO20
封裝: PLASTIC, TSSOP-20
文件頁(yè)數(shù): 29/43頁(yè)
文件大小: 869K
代理商: MSP430F1101IPWR
PACKAGE OPTION ADDENDUM
www.ti.com
28-Oct-2010
Addendum-Page 3
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MSP430F110AIDW 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Texas Instruments 功能描述:
MSP430F110AIDWR 制造商:TI 制造商全稱:Texas Instruments 功能描述:MIXED SIGNAL MICROCONTROLLER
MSP430F110AIPW 制造商:Rochester Electronics LLC 功能描述:16-BIT ULTRA-LOW-POWER MICROCONTROLLER, 1KB FLASH, 128B RAM - Bulk
MSP430F110AIPWR 制造商:TI 制造商全稱:Texas Instruments 功能描述:MIXED SIGNAL MICROCONTROLLER
MSP430F110IDW 功能描述:IC MCU 16BIT 1KB FLASH 20-SOIC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:MSP430x1xx 產(chǎn)品培訓(xùn)模塊:8-bit PIC® Microcontroller Portfolio 標(biāo)準(zhǔn)包裝:91 系列:PIC® XLP™ mTouch™ 16F 核心處理器:PIC 芯體尺寸:8-位 速度:32MHz 連通性:I²C,LIN,SPI,UART/USART 外圍設(shè)備:欠壓檢測(cè)/復(fù)位,POR,PWM,WDT 輸入/輸出數(shù):11 程序存儲(chǔ)器容量:14KB(8K x 14) 程序存儲(chǔ)器類型:閃存 EEPROM 大小:256 x 8 RAM 容量:1K x 8 電壓 - 電源 (Vcc/Vdd):1.8 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:16-VQFN 裸露焊盤 包裝:管件