參數(shù)資料
型號(hào)： MSP430F2619SKGD1
廠商： TEXAS INSTRUMENTS INC
元件分類： 微控制器/微處理器
英文描述： 16-BIT, FLASH, 16 MHz, RISC MICROCONTROLLER, UUC82
封裝： DIE-82
文件頁(yè)數(shù)： 62/90頁(yè)
文件大?。?/td> 1141K
代理商： MSP430F2619SKGD1
Positive
Negative
VR+
Gain Error
Offset Error
DAC Code
DAC V OUT
Ideal transfer
function
RLoad =
AV CC
CLoad = 100pF
2
DAC Output
SLAS697A
– MARCH 2010 – REVISED FEBRUARY 2011
12-Bit DAC Linearity Parameters
– Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
Resolution
12-bit monotonic
12
bits
VREF = 1.5 V
±2
±8
DAC12AMPx = 7, DAC12IR = 1
INL
Integral nonlinearity(1)
2.2 V/3 V
LSB
VREF = 2.5 V
±2
±8
DAC12AMPx = 7, DAC12IR = 1
VREF = 1.5 V
±0.4
±1
DAC12AMPx = 7, DAC12IR = 1
DNL
Differential nonlinearity(1)
2.2 V/3 V
LSB
VREF = 2.5 V
±0.4
±1
DAC12AMPx = 7, DAC12IR = 1
VREF = 1.5 V
±21
DAC12AMPx = 7, DAC12IR = 1
Offset voltage without
calibration(1)(2)
VREF = 2.5 V
±21
DAC12AMPx = 7, DAC12IR = 1
EO
2.2 V/3 V
LSB
VREF = 1.5 V
±3.5
DAC12AMPx = 7, DAC12IR = 1
Offset voltage with
calibration(1)(2)
VREF = 2.5 V
±3.5
DAC12AMPx = 7, DAC12IR = 1
Offset error temperature
dE(O)/dT
30
V/°C
coefficient(1)
VREF = 1.5 V
±3.5
EG
Gain error(1)
2.2 V/3 V
LSB
VREF = 2.5 V
±3.5
Gain temperature
ppm of
dE(G)/dT
10
coefficient(1)
FSR/
°C
DAC12AMPx = 2
100
tOffset_Cal
Time for offset calibration(3)
DAC12AMPx = 3, 5
2.2 V/3 V
32
LSB
DAC12AMPx = 4, 6, 7
6
(1)
Parameters calculated from the best-fit curve from 0x0A to 0xFFF. The best-fit curve method is used to deliver coefficients
“a” and “b” of
the first-order equation: y = a + b
× x. VDAC12_xOUT = EO + (1 + EG) × (VeREF+/4095) × DAC12_xDAT, DAC12IR = 1.
(2)
The offset calibration works on the output operational amplifier. Offset calibration is triggered setting bit DAC12CALON.
(3)
The offset calibration can be done if DAC12AMPx = {2, 3, 4, 5, 6, 7}. The output operational amplifier is switched off with
DAC12AMPx={0, 1}.The DAC12 module should be configured prior to initiating calibration. Port activity during calibration may affect
accuracy and is not recommended.
Figure 42. Linearity Test Load Conditions and Gain/Offset Definition
2010–2011, Texas Instruments Incorporated
65
Product Folder Link(s): MSP430F2619S-HT
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MSP430F2619SPM 功能描述:16位微控制器 - MCU 16B Ultra-Low-Pwr MCU,92KB Flash RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MSP430F2619TPM 功能描述:16位微控制器 - MCU 16B Ultra-Lo-Pwr MCU RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MSP430F2619TPMR 功能描述:16位微控制器 - MCU 16B Ultra-Lo-Pwr MCU RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MSP430F2619TPN 功能描述:16位微控制器 - MCU 16B Ultra-Lo-Pwr MCU RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MSP430F2619TPNR 功能描述:16位微控制器 - MCU 16B Ultra-Lo-Pwr MCU RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
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