參數(shù)資料
型號: MT29C2G24MAKLACG-75IT
元件分類: 存儲器
英文描述: SPECIALTY MEMORY CIRCUIT, PBGA152
封裝: GREEN, VFBGA-152
文件頁數(shù): 5/15頁
文件大?。?/td> 421K
代理商: MT29C2G24MAKLACG-75IT
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
Micron Technology, Inc., reserves the right to change products or specifications without notice.
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
13
2008 Micron Technology, Inc. All rights reserved.
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Package Dimensions
Preliminary
Figure 8:
152-Ball VFBGA (Package Code: CG)
Note:
All dimensions are in millimeters.
Ball A1 ID
0.6 ±0.1
Seating
plane
0.1 A
A
1.0 MAX
Ball A1 ID
0.65 TYP
13 CTR
14 ±0.1
Solder ball
material: SAC105.
Dimensions apply
to solder balls post-
reflow on 0.35
SMD ball pads.
152X 0.46
0.35 MIN
13 CTR
14 ±0.1
0.65 TYP
21 20 19 18 17 16 15 14 13 12 11 10 9 8 7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
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