參數(shù)資料
型號(hào)： NAND01GW3B2AN6F
廠商： NUMONYX
元件分類： PROM
英文描述： 128M X 8 FLASH 3V PROM, 25000 ns, PDSO48
封裝： 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48
文件頁(yè)數(shù)： 22/64頁(yè)
文件大小： 632K
代理商： NAND01GW3B2AN6F
NAND01G-B, NAND02G-B
Device operations
29/64
6.4
Copy Back Program
The Copy Back Program operation is used to copy the data stored in one page and
reprogram it in another page.
The Copy Back Program operation does not require external memory and so the operation
is faster and more efficient because the reading and loading cycles are not required. The
operation is particularly useful when a portion of a block is updated and the rest of the block
needs to be copied to the newly assigned block.
If the Copy Back Program operation fails an error is signalled in the Status Register.
However as the standard external ECC cannot be used with the Copy Back Program
operation bit error due to charge loss cannot be detected. For this reason it is recommended
to limit the number of Copy Back Program operations on the same data and or to improve
the performance of the ECC.
The Copy Back Program operation requires four steps:
1.
The first step reads the source page. The operation copies all 1056 Words/ 2112 Bytes
from the page into the Data Buffer. It requires:
–
one bus write cycle to setup the command
–
4 bus write cycles to input the source page address
–
one bus write cycle to issue the confirm command code
2.
When the device returns to the ready state (Ready/Busy High), the next bus write cycle
of the command is given with the 4 bus cycles to input the target page address. Refer
to Table 11 for the addresses that must be the same for the Source and Target pages.
3.
Then the confirm command is issued to start the P/E/R Controller.
To see the Data Input cycle for modifying the source page and an example of the Copy Back
Program operation refer to Figure 12.
A data input cycle to modify a portion or a multiple distant portion of the source page, is
shown in Figure 13
Table 11.
Copy Back Program x8 Addresses
Density
Same Address for Source and Target Pages
1 Gbit
no constraint
2 Gbit
no constraint
2 Gbit DD(1)
1.
DD = Dual Die
A28
Table 12.
Copy Back Program x16 Addresses
Density
Same Address for Source and Target Pages
1 Gbit
no constraint
2 Gbit
no constraint
2 Gbit DD(1)
1.
DD = Dual Die
A27
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
NAND01GW3B2AN6T 功能描述:閃存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲(chǔ)類型:Flash 存儲(chǔ)容量:2 MB 結(jié)構(gòu):256 K x 8 定時(shí)類型: 接口類型:SPI 訪問(wèn)時(shí)間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
NAND01GW3B2AZA1 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:1 Gbit, 2 Gbit, 2112 Byte/1056 Word Page, 1.8V/3V, NAND Flash Memory
NAND01GW3B2AZA6 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:1 Gbit, 2 Gbit, 2112 Byte/1056 Word Page, 1.8V/3V, NAND Flash Memory
NAND01GW3B2AZA6E 功能描述:閃存 NAND MEDIA FLASH RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲(chǔ)類型:Flash 存儲(chǔ)容量:2 MB 結(jié)構(gòu):256 K x 8 定時(shí)類型: 接口類型:SPI 訪問(wèn)時(shí)間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
NAND01GW3B2AZA6F 制造商:Micron Technology Inc 功能描述:FLASH PARALLEL 3.3V 1GBIT 128MX8 25US 63VFBGA - Tape and Reel
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