- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄11731 > ORT82G5-2F680C (Lattice Semiconductor Corporation)IC FPSC TRANSCEIVER 8CH 680-BGA PDF資料下載
參數(shù)資料
| 型號(hào)： | ORT82G5-2F680C |
| 廠商： | Lattice Semiconductor Corporation |
| 文件頁(yè)數(shù)： | 19/119頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC FPSC TRANSCEIVER 8CH 680-BGA |
| 產(chǎn)品變化通告： | Product Discontinuation 01/Aug/2011 |
| 標(biāo)準(zhǔn)包裝： | 24 |
| 系列： | * |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)當(dāng)前第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)
Lattice Semiconductor
ORCA ORT42G5 and ORT82G5 Data Sheet
115
where TC is the case temperature at top dead center, TJ is the junction temperature, and Q is the chip power. Dur-
ing the ΘJA measurements described above, besides the other parameters measured, an additional temperature
reading, TC, is made with a thermocouple attached at top-dead-center of the case. ψJC is also expressed in units of
°C/W.
Θ
ΘJC
This is the thermal resistance from junction to case. It is most often used when attaching a heat sink to the top of
the package. It is dened by:
(3)
The parameters in this equation have been dened above. However, the measurements are performed with the
case of the part pressed against a water-cooled heat sink to draw most of the heat generated by the chip out the
top of the package. It is this difference in the measurement process that differentiates ΘJC from ψJC. ΘJC is a true
thermal resistance and is expressed in units of °C/W.
ΘJB
This is the thermal resistance from junction to board. It is dened by:
(4)
where TB is the temperature of the board adjacent to a lead measured with a thermocouple. The other parameters
on the right-hand side have been dened above. This is considered a true thermal resistance, and the measure-
ment is made with a water-cooled heat sink pressed against the board to draw most of the heat out of the leads.
Note that ΘJB is expressed in units of °C/W and that this parameter and the way it is measured are still being dis-
cussed by the JEDEC committee.
FPSC Maximum Junction Temperature
Once the power dissipated by the FPSC has been determined, the maximum junction temperature of the FPSC
can be found. This is needed to determine if speed derating of the device from the 85 °C junction temperature used
in all of the delay tables is needed. Using the maximum ambient temperature, TAmax, and the power dissipated by
the device, Q (expressed in °C), the maximum junction temperature is approximated by:
(5)
Package Thermal Characteristics
The thermal characteristics of the 484-ball PBGAM (fpBGA with heat spreader) used for the ORT42G5, the 680-
ball PBGAM (fpBGA with heat spreader) and the 680-ball fpBGA used for the ORT82G5 are available in the Ther-
mal Management section of the Lattice web site at www.latticesemi.com.
Heat Sink Vendors for BGA Packages
The estimated worst-case power requirements for the ORT42G5 and ORT82G5 are in the 3 W to 5 W range. Con-
sequently, for most applications an external heat sink will be required. Table 46 lists, in alphabetical order, heat sink
vendors who advertise heat sinks aimed at the BGA market.
ΘJC =
TJ – TC
Q
ΘJB =
TJ – TB
Q
TJmax = TAmax + (Q ΘJB)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| D38999/26JC8PN | CONN PLUG 8POS STRAIGHT W/PINS |
| MS27467T25F61SC | CONN PLUG 61POS STRAIGHT W/SCKT |
| 31-320-RFX | BNC PLUG, CRIMP RG-58 |
| D38999/24JD19PN | CONN RCPT 19POS JAM NUT W/PINS |
| D38999/20WG39SN | CONN RCPT 39POS WALL MNT W/SCKT |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ORT82G5-2F680I | 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 ORCA FPSC 2.7GBITS/s BP XCVR 643K RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| ORT82G5-2FN680C | 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 ORCA FPSC 1.5V 3.7 G b Bpln Xcvr 643K Gt RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| ORT82G5-2FN680C1 | 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| ORT82G5-2FN680I | 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 ORCA FPSC 3.7 Gb Bp ln Xcvr 643K Gt I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| ORT82G5-2FN680I1 | 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。