參數(shù)資料
型號： ORT82G5-2F680C
廠商： Lattice Semiconductor Corporation
文件頁數(shù)： 20/119頁
文件大?。?/td> 0K
描述： IC FPSC TRANSCEIVER 8CH 680-BGA
產(chǎn)品變化通告： Product Discontinuation 01/Aug/2011
標(biāo)準(zhǔn)包裝： 24
系列： *
Lattice Semiconductor
ORCA ORT42G5 and ORT82G5 Data Sheet
116
Table 46. Heat Sink Vendors
Package Parasitics
The electrical performance of an IC package, such as signal quality and noise sensitivity, is directly affected by the
package parasitics. Table 47 lists eight parasitics associated with the ORCA packages. These parasitics represent
the contributions of all components of a package, which include the bond wires, all internal package routing, and
the external leads.
Four inductances in nH are listed: LSW and LSL, the self-inductance of the lead; and LMW and LML, the mutual
inductance to the nearest neighbor lead. These parameters are important in determining ground bounce noise and
inductive crosstalk noise. Three capacitances in pF are listed: CM, the mutual capacitance of the lead to the near-
est neighbor lead; and C1 and C2, the total capacitance of the lead to all other leads (all other leads are assumed
to be grounded). These parameters are important in determining capacitive crosstalk and the capacitive loading
effect of the lead. Resistance values are in mΩ.
The parasitic values in Table 47 are for the circuit model of bond wire and package lead parasitics. If the mutual
capacitance value is not used in the designer’s model, then the value listed as mutual capacitance should be
added to each of the C1 and C2 capacitors.
Table 47. ORCA Typical Package Parasitics
Figure 41. Package Parasitics
Package Outline Drawings
Package Outline Drawings for the 484-ball PBGAM (fpBGA) used for the ORT42G5 and 680-ball PBGAM (fpBGA)
used for the ORT82G5 are available in the Package Diagrams section of the Lattice Semiconductor web site at
www.latticesemi.com.
Vendor
Location
Phone
Aavid Thermalloy
Concord, NH
(603) 224-9988
Chip Coolers
Warwick, RI
(800) 227-0254
IERC
Burbank, CA
(818) 842-7277
R-Theta
Buffalo, NY
(800) 388-5428
Sanyo Denki
Torrance, CA
(310) 783-5400
Wakeeld Thermal Solutions
Pelham, NH
(800) 325-1426
LSW
LMW
RW
C1
C2
CM
LSL
LML
3.8
1.3
250
1.0
0.3
2.8-5
0.5 -1
PAD N
Board Pads
CM
C1
LSW
RW
LSL
LMW
C2
C1
LML
C2
PAD N + 1
LSW
RW
LSL
Circuit
Pad N+1
Pad N
Package
Pads
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ORT82G5-2F680I 功能描述:FPGA - 現(xiàn)場可編程門陣列 ORCA FPSC 2.7GBITS/s BP XCVR 643K RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-2FN680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 ORCA FPSC 1.5V 3.7 G b Bpln Xcvr 643K Gt RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-2FN680C1 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-2FN680I 功能描述:FPGA - 現(xiàn)場可編程門陣列 ORCA FPSC 3.7 Gb Bp ln Xcvr 643K Gt I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-2FN680I1 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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