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參數(shù)資料
| 型號： | P11062EJ3V0IF00 |
| 英文描述： | 6-pin Mini Mold Semiconductors for High Frequency Use Taping Specifications |
| 中文描述： | 6針高頻率使用的編帶規(guī)格小模半導(dǎo)體 |
| 文件頁數(shù)： | 10/15頁 |
| 文件大?。?/td> | 79K |
| 代理商： | P11062EJ3V0IF00 |
10
2.3.2
QUANTITY
3 000 pcs/reel
2.3.3
MISSING DEVICE
ITEM
SPEC
REMARKS
Consective
None
Within 40 mm to carrier except leader and trailer
Sporadic
0.2 % max/reel
Except leader and trailer
Others
Taping with wrong orientation, up side down and wrong device are not allowed
2.3.4
SPLICING
No carrier or cover tape should be spliced.
2.3.5
TAKING PACKAGED DEVICE OUT OF THE TAPE
1)
2)
Packaged devices should not adhere to the cover tape.
Excess Epoxy mold should not affect on taking the device out.
2.3.6
STORAGE ENVIRONMENT
Taping products should be stored with the following conditions.
Ambient Temperature ;
Humidity
T
A
=
10 to +40
°
C
80 % MAX.
;
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