參數(shù)資料
型號: P11062EJ3V0IF00
英文描述: 6-pin Mini Mold Semiconductors for High Frequency Use Taping Specifications
中文描述: 6針高頻率使用的編帶規(guī)格小模半導(dǎo)體
文件頁數(shù): 11/15頁
文件大?。?/td> 79K
代理商: P11062EJ3V0IF00
11
2.4
PACKAGED DEVICE ORIENTATION
C2H
C2H
C2H
1 PIN
“–E3”
C
C
C
1 PIN
“–E4”
Two taping orientations are specified as -E3 and -E4 in above drawing. In the drawing,
marking is an example. (As for markings, please refer to the data sheet of each product.)
Either -E3 or -E4 must be included in the part number. (see page 10.)
2.5
DIMENSIONS OF 6 PIN MINI MOLD PACKAGE
1
2
3
6
5
4
0.95
0.95
1.9
2.9 ± 0.2
0.13 ± 0.1
1
+
0.3
+ 0.1
1.1
+ 0.2
2
+
0 to 0.1
0.8
Device weight: approx. 13 mg (for reference)
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