參數(shù)資料
型號: P11062EJ3V0IF00
英文描述: 6-pin Mini Mold Semiconductors for High Frequency Use Taping Specifications
中文描述: 6針高頻率使用的編帶規(guī)格小模半導體
文件頁數(shù): 12/15頁
文件大?。?/td> 79K
代理商: P11062EJ3V0IF00
12
3.
MECHANICAL DATA
ITEM
DATA
REMARKS
Cover tape adhesion
20 to 70 gf
(30 mm/minute)
carrier tape
F
10
direction of tape.
Tape bend strength
When the tape is bent with 15.0 mm radius, no device should pop out
4.
PACKING
10 reels are packed in corrugated cardbord box.
The part number including orientation symbol, rank, quantity, lot code and company are indicated on the box.
5.
ORDERING INFORMATION
In the case of order placement, please order with the following procedure.
<1> Part Number
<2> Orientation
<3> Rank
<4> quantity
<Example>
{
{
PC2771T – E3 KB 30,000 pcs
μ
Quantity (3,000 pcs
×
N)
Rank
Orientation
Part Number
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