參數(shù)資料
型號(hào): P11062EJ3V0IF00
英文描述: 6-pin Mini Mold Semiconductors for High Frequency Use Taping Specifications
中文描述: 6針高頻率使用的編帶規(guī)格小模半導(dǎo)體
文件頁數(shù): 7/15頁
文件大?。?/td> 79K
代理商: P11062EJ3V0IF00
7
Length Unit: mm, Angle Unit: deg.
ITEM
SYMBOL
SIZE
REMARKS
Length
A
3.18
Opening size
Width
B
3.40
Opening size
Depth
K
0
1.4
±
0.1
Inner size
Pocket
Pitch
F
4.0
±
0.1
Accumulated Tolerance –0.3
Diameter
J
φ
1.5
Pitch
H
4.0
±
0.1
Accumulated Tolerance–0.3
Perforation
Position
E
1.75
±
0.1
Length
Direction
G
2.0
±
0.05
Distance
Between
Center-line
Width
Direction
D
3.5
±
0.05
Cover Tape
Width
W
5.5
Thickness: 0.1 Max.
Width
C
8.0
±
0.2
Bend:
δ
0.3 Max.
Thickness
t
0.3
±
0.05
Diameter
D
1
φ
1.0
Carrier Tape
Depth
K
1
1.6
±
0.1
Outline
See the product specification
Mini Mold
Device
Tilt
θ
20
°
MAX.
Overall Thickness
K
1.65
±
0.1
Dimentions of 6 pin Mini Mold package
+0.3
–0
+0.1
–0.05
+0.1
–0.1
+0.1
–0.1
+0.1
+0.2
–0.05
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