參數(shù)資料
型號(hào): PC755CVGSU366LE
廠商: ATMEL CORP
元件分類: 微控制器/微處理器
英文描述: PowerPC 755/745 RISC Microprocessor
中文描述: 32-BIT, 366 MHz, RISC PROCESSOR, CBGA360
封裝: SOLDER COLUMN INTERPOSER, CERAMIC, BGA-360
文件頁(yè)數(shù): 38/50頁(yè)
文件大小: 1064K
代理商: PC755CVGSU366LE
38
PC755/745
2138D–HIREL–06/03
Figure 25.
Mechanical Dimensions and Bottom Surface Nomenclature of the PC745 PBGA
Parameters for the PC755
PBGA
Package Parameter for the
PC755 PBGA
The package parameters are as provided in the following list. The package type is 25 x
25 mm, 360-lead plastic ball grid array (PBGA).
Package outline
25 x 25 mm
Interconnects
360 (19 x 19 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.22 mm
Maximum module height
2.77 mm
Ball diameter
0.75 mm (29.5 mil)
M
Table 1
Millimeters
DIM
Min
Max
A
2.25
2.80
A1
0.50
0.70
A2
1.00
1.20
b
0.60
0.90
D
21.00 BSC
E
21.00 BSC
e
1.27 BSC
0.2
D
2X
A1 CORNER
E
0.2
B
A
A
A1
A2
C
0.15 C
B
C
C
255X
e
1 2 3 4 5 6 7 8 9 10 111213141516
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
A
0.3
0.15
b
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
4. CAPACITOR PADS MAY BE UNPOPULATED.
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