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參數(shù)資料
| 型號： | PID9q-604e |
| 廠商： | IBM Microeletronics |
| 英文描述： | 32-Bit RISC Microprocessor(32位精簡指令集微處理器) |
| 中文描述： | 32位RISC微處理器（32位精簡指令集微處理器） |
| 文件頁數(shù)： | 26/29頁 |
| 文件大?。?/td> | 543K |
| 代理商： | PID9Q-604E |
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26
PID9q-604e Hardware Datasheet
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
IBM
1.8.6.2 Thermal Management Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
T
j
= T
a
+ T
r
+ (R
q
jc
+R
a
+ R
sa
) * Q
Where
:
T
j
is the die-junction temperature
T
a
is the inlet cabinet ambient temperature
T
r
is the air temperature rise within the system cabinet
R
q
jc
is the die-junction-to-top of die thermal resistance of the device
R
a
is the thermal resistance of the thermal interface material (thermal grease or thermal
compound)
R
sa
is the heat sink-to-ambient thermal resistance
Q is the power consumed by the device
Typical die-junction temperatures (T
j
) should be maintained less than 105 °C. The temperature of
the air cooling the component greatly depends upon the ambient inlet air temperature and the air
temperature rise within the computer cabinet. A computer cabinet inlet-air temperature (T
a
) may
range from 30 to 40 °C. The air temperature rise within a cabinet (T
r
) may be in the range of 5 to
10 °C. The thermal resistance of the interface material (R
a
) is typically about 1 °C/W. Assuming a
T
a
of 30 °C, a T
r
of 5 °C, and a power consumption (Q) of 7.5 watts, the following expression for
T
j
is obtained:
Junction temperature: T
j
= 30 °C + 5 °C + (0.03 °C/W + 1.0 °C/W + R
sa
) * 7.5 W
For a Thermalloy heat sink #2333B, the heat sink-to-ambient thermal resistance (R
sa
) versus
airflow velocity is shown in Figure 14.
1
3
5
7
8
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin-fin Heat Sink
(25 x28 x 15 mm)
Approach Air Velocity (m/s)
H
2
4
6
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